Robust optimization design method for hot air reflow welding process

Abstract

The invention discloses a robust optimization design method for a hot air reflow welding process, which comprises the following steps of: establishing a sensitivity analysis method of each noise factor and design variable to a target and a constraint condition by establishing an accurate reflow welding process temperature field simulation model and determining the target and the constraint condition; screening noise factors and design variables which have significant influence on the heating factor; sampling new design variables and noise factors to obtain sample points again, and constructingan agent model of a prediction target function and a constraint function; obtaining an optimal scheme determination solution based on response surface optimization, verifying the precision of the response surface constructed by the agent model, and carrying out robustness evaluation on the optimal solution; and finally, obtaining the most robust solution, substituting the most robust solution into the original simulation model to carry out reliability analysis, verifying robustness, and further carrying out process parameter optimization design according to a robustness target value to ensurethat a process result has robustness.

Description

technical field [0001] The invention relates to the technical field of electronic product manufacturing, in particular to a robust optimization design method for a hot air reflow soldering process. Background technique [0002] The hot air reflow soldering process is currently the most commonly used process for assembly and soldering of electronic products. The design of hot air reflow soldering process parameters directly affects the soldering performance and reliability of electronic products, and is an important issue in the field. In the actual production process, the design of process parameters generally adopts multiple physical tests and then continuously adjusts the process parameters according to the test results. However, due to the limitations of the number of tests and test costs, this method is difficult to consider PCBA component material characteristic fluctuations, environmental conditions, etc. The impact of load fluctuations and other objective factors flu...

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Problems solved by technology

In the actual production process, the design of process parameters generally adopts multiple physical tests and then continuously adjusts the process parameters according to the test results. However, due to the limitations of the number of tests and test costs, this method is difficult to consider PCBA component material characteristic fluctuations, environmental conditions, etc. The impact of load fluctuations and other objective factor fluctuations on process quality objectives

If the variation range of fluctuations in the process is large, the fluctuation range of the process output results will increase, resulting in greater inconsistency and higher defect rates in the same batch of electronic products

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