Double-layer substrate and light source device

Abstract

The invention provides a double-layer substrate and a light source device, and the double-layer substrate is composed of an upper insulating plate and a lower insulating plate. A mature process can beadopted to independently embed the heat conduction piece on the upper insulating plate in advance and embed the electric conductor on the lower insulating plate, and the double-layer substrate and the light source device are easy to achieve, high in manufacturing efficiency and yield and low in cost; besides, compared with a single-layer PCB with the same thickness, the height of the heat conduction piece is only half of or even smaller than that of the heat conduction piece which is used for guiding out heat generated by the light-emitting chip in the single-layer PCB, so heat dissipation paths can be greatly reduced, and the heat dissipation performance is better; besides, the corresponding upper conductive connecting part and the middle conductive connecting part are electrically connected through the conductive adhesive layer, so that the reliability of conductive connection between the corresponding upper conductive connecting part and the middle conductive connecting part can beimproved, the fitting tightness between the upper insulating plate and the lower insulating plate can be improved, and the air tightness between the upper insulating plate and the lower insulating plate can be improved; therefore, the protection performance is improved.

Description

technical field [0001] The invention relates to the field of light emitting diodes, in particular to a double-layer substrate and a light source device. Background technique [0002] With the in-depth application of light-emitting diodes in various fields such as backlighting and lighting, the requirements for light-emitting LEDs are also increasing. At present, there are the following bottlenecks in the application process of LEDs: [0003] The luminance of a single LED made by a single LED chip is not high enough to better meet the needs of high-brightness display; [0004] LEDs are generally packaged by LED brackets combined with LED chips, and the cost is high. Moreover, due to the use of LED brackets, the size of the LEDs is large, which cannot meet the needs of light and thin, ultra-narrow black borders; [0005] If the LED bracket is to be omitted, and the LED chip is directly arranged on a single-layer PCB, there is a large technical span, and the existing process ...

AI Technical Summary

Problems solved by technology

[0003] The luminance of a single LED made by a single LED chip is not high enough to better meet the needs of high-brightness display;

[0004] LEDs are generally packaged by LED brackets combined with LED chips, and the cost is high. Moreover, due to the use of LED brackets, the size of the LEDs is large, which cannot meet the needs of light and thin, ultra-narrow black borders;

[0005] If the LED bracket is to be omitted, and the LED chip is directly placed on the single-layer PCB, there is a large technical span, and the existing process has problems such as high technical difficulty, poor heat dissipation performance, low yield rate, and high cost.

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