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LED device and package method thereof, backlight module, liquid crystal display module and terminal

A technology for LED devices and packaging methods, applied in semiconductor devices, optics, instruments, etc., can solve problems such as large size, inability to meet user high-brightness requirements, and unsuitable for thin and light products, and achieve the effect of improving overall brightness

Inactive Publication Date: 2019-07-05
HUIZHOU JUFEI OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is that the size of the existing traditional bracket-type LED device is too large to be suitable for light and thin products, and it cannot meet the user's demand for high brightness. The present invention provides an LED device and its packaging method And a backlight module, a liquid crystal display module and a terminal composed of LED devices made by the LED device packaging method

Method used

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  • LED device and package method thereof, backlight module, liquid crystal display module and terminal
  • LED device and package method thereof, backlight module, liquid crystal display module and terminal
  • LED device and package method thereof, backlight module, liquid crystal display module and terminal

Examples

Experimental program
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Effect test

Embodiment 1

[0044] This embodiment provides a single-side light-emitting LED device, such as Figure 1-2As shown, the device includes a PCB board 1, a light-emitting chip 2 arranged in sequence along a direction away from the PCB board 1, and a light-transmitting adhesive layer 3. The light-transmitting adhesive layer includes a first phosphor powder 31, a second phosphor powder 32, and an encapsulation adhesive layer 33. , the light-emitting chip 2 and the light-transmitting adhesive layer 3 form a light-emitting component, and a side sealant layer 4 is provided on the side of the light-emitting component.

[0045] In practical applications, the light-transmitting adhesive layer 3 also includes a top-surface encapsulating adhesive layer 5, such as image 3 shown.

[0046] Specifically, the fluorescent glue layer is pasted on the light-emitting chip; the fluorescent glue layer at least includes first phosphor powder and second phosphor powder, and the first phosphor powder and the second...

Embodiment 2

[0070] This embodiment provides a single-side light-emitting LED device packaging method, which includes the following steps:

[0071] S1. Provide a substrate, the substrate is a glass substrate, a pyrolytic adhesive film layer is pasted on the surface of the substrate, and a mixture of the first phosphor layer and the second phosphor layer is sequentially deposited and mixed on the surface of the pyrolytic adhesive film layer by physical vapor deposition Phosphor layer, the raw material of the first phosphor layer is a commercially available silicate phosphor powder doped with rare earth ions, and its emission wavelength is 580nm; the raw material of the second phosphor layer is Sialon phosphor powder, and its emission wavelength is 500nm, during the physical vapor deposition process, the chamber pressure is 100Pa, and the power is 100W.

[0072] S2. Fill the surface of the second phosphor with encapsulation glue, add the encapsulation glue to the surface of the second phosph...

Embodiment 3

[0082] This embodiment provides a single-side light-emitting LED device packaging method, which includes the following steps:

[0083] S1. Provide a substrate. The substrate is a ceramic substrate. A UV film layer is pasted on the surface of the substrate, and a mixed phosphor powder mixed in the order of the first phosphor powder and the second phosphor powder is deposited on the surface of the UV film layer by physical vapor deposition. Obtain the first phosphor layer and the second phosphor layer. The raw material of the first phosphor layer is commercially available phosphate phosphor powder doped with rare earth ions, and its emission wavelength is 680nm. The raw material of the second phosphor layer is doped The sulfide phosphor with rare earth ions emits light at a wavelength of 580nm. During the physical vapor deposition process, the chamber pressure is 1000Pa and the power is 500W.

[0084] S2. Fill the surface of the second phosphor layer with encapsulation glue, add...

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Abstract

The present invention discloses a LED device and a package method thereof, a backlight module, a liquid crystal display module and a terminal. The package method of the LED device comprises the stepsof: depositing pre-prepared mixed phosphor by employing a physical vapor deposition method, filling the surface of the mixed phosphor with package glue and baking the surface of the mixed phosphor toobtain a fluorescent glue layer, obtaining a light transmitting glue layer based on the fluorescent glue layer, putting the obtained light transmitting glue layer on a substrate inversely, pasting a light emitting chip at the surface of the mixed phosphor, baking and curing the light emitting chip and then cutting the light emitting chip to obtain a single light emitting module, and pasting at least two light emitting modules on a PCB for cutting to obtain a single-sided light emitting LED device after package. The LED device prepared by employing the method is small in volume and low in thickness, is suitable for a backlight source with high lightness and thinness requirements such as a mobile phone, and solves the problems that a traditional support LED device is difficult to reduce thesize and the produced small-sized LED device is low in production yield.

Description

technical field [0001] The invention relates to the technical field of LED packaging, more specifically, to an LED device, a packaging method thereof, a backlight module, a liquid crystal display module and a terminal. Background technique [0002] A light-emitting diode (LED) is a solid-state semiconductor device that uses a solid semiconductor chip as a light-emitting material. When a forward voltage is applied to both ends, the carriers in the semiconductor recombine, releasing excess energy to cause photon emission to produce visible light. In terms of production, in addition to welding the two electrodes of the LED chip to lead out the positive and negative electrodes, it is also necessary to protect the LED chip and the two electrodes, that is, to carry out LED packaging. [0003] At present, the mainstream LED packaging form on the market is the LED light source with a bracket. The size of the packaged light source in this package is much larger than the size of the c...

Claims

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Application Information

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IPC IPC(8): H01L33/54H01L33/50G02F1/13357
CPCG02F1/133603H01L33/505H01L33/54H01L2933/0041
Inventor 李超凡邢其彬张志宽徐欣荣姚亚澜
Owner HUIZHOU JUFEI OPTOELECTRONICS CO LTD