LED device and package method thereof, backlight module, liquid crystal display module and terminal
A technology of LED devices and packaging methods, which is applied in semiconductor devices, optics, instruments, etc., can solve the problems of large size, low color area concentration, and not suitable for light and thin products, achieve high color area concentration, improve overall brightness, High luminous brightness and excellent effect
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Embodiment 1
[0044] This embodiment provides a single-side light-emitting LED device, such as Figure 1-3 As shown, the device includes a PCB board 1, a light-emitting chip 2 arranged in sequence along a direction away from the PCB board 1, and a fluorescent adhesive layer 3. The fluorescent adhesive layer includes a first phosphor powder 31, a second phosphor powder 32, and an encapsulation adhesive layer 33. , the light-emitting chip 2 and the fluorescent adhesive layer 3 form a light-emitting component, and a side sealant layer 4 is provided on the side of the light-emitting component.
[0045] Wherein, the first fluorescent powder and the second fluorescent powder are concentrated and distributed in the fluorescent adhesive layer close to the light-emitting chip, the wavelength of the emitted light of the first fluorescent powder layer is 500-680nm, and the wavelength of the emitted light of the second fluorescent powder layer is 500-680nm ; Preferably, the emission wavelength of the f...
Embodiment 2
[0067] This embodiment provides a single-side light-emitting LED device packaging method, which includes the following steps:
[0068] S1. Provide a substrate, the substrate is a glass substrate, a pyrolytic adhesive film layer is attached on the surface of the substrate, and the first phosphor layer is deposited on the surface of the pyrolytic adhesive film layer by physical vapor deposition. The raw material of the first phosphor layer is commercially available Silicate fluorescent powder doped with rare earth ions, the emission wavelength is 580nm, and the deposition time is 0.5min.
[0069] S2. Deposit the second phosphor layer on the surface of the first phosphor layer by physical vapor deposition method. The raw material of the second phosphor layer is Sialon phosphor, the emission wavelength is 500nm, and the deposition time is 35min. The physical vapor deposition process , the chamber pressure is 100Pa, and the power is 100W.
[0070] S3. Fill the surface of the secon...
Embodiment 3
[0079] This embodiment provides a single-side light-emitting LED device packaging method, which includes the following steps:
[0080] S1. Provide a substrate. The substrate is a ceramic substrate. A UV film layer is pasted on the surface of the substrate. The first phosphor layer is deposited on the surface of the UV film layer by physical vapor deposition. The raw material of the first phosphor layer is commercially available doped Phosphate fluorescent powder mixed with rare earth ions, the emission wavelength is 680nm, and the deposition time is 20min.
[0081] S2. The second phosphor layer is deposited on the surface of the first phosphor layer by physical vapor deposition. The raw material of the second phosphor layer is a sulfide phosphor doped with rare earth ions. The emitted light wavelength is 580nm, and the deposition time is 0.5min, during the physical vapor deposition process, the chamber pressure is 1000Pa, and the power is 500W.
[0082] S3. Fill the surface o...
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