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A kind of heat-conducting and wave-absorbing integrated graphene thermal interface material and preparation method thereof

A technology of thermal interface material and graphene, applied in heat exchange materials, chemical instruments and methods, chemical industry, etc., can solve the problems of size limitation, complicated process, unsuitable for large-scale production, etc., and achieve the increase of dosage, High absorption, oil absorption value reduction effect

Active Publication Date: 2022-06-07
德阳中碳新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] CN 110294939 A utilizes flaky graphite powder, flaky nickel-plated graphite powder, flaky gold-copper powder, flaky silver powder and other thermal conductive fillers as thermal conductive fillers, and uses spherical nickel powder, carbonyl iron powder, carbonyl nickel powder, nickel-coated carbon powder, Nickel-coated aluminum powder, silver-coated aluminum powder, and silver-coated copper powder are used as wave-absorbing fillers. By orienting two-dimensional thermally conductive fillers, a thermal interface material with a thermal conductivity greater than 10W / mK is prepared. This method utilizes thermally conductive fillers. High thermal conductivity wave-absorbing gaskets are restricted in the length direction, and the size is limited, and the process is complicated, so it is not suitable for large-scale production

Method used

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  • A kind of heat-conducting and wave-absorbing integrated graphene thermal interface material and preparation method thereof
  • A kind of heat-conducting and wave-absorbing integrated graphene thermal interface material and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0039] This embodiment provides a graphene thermal interface material integrated with heat conduction and wave absorption.

[0040] The preparation steps are as follows:

[0041] S1. In parts by weight, use 100 parts of Al with a particle size D50 of 2um 2 O 3 Add it to the high-speed mixer, add 1 part of KH-550 to 50 parts of anhydrous ethanol and mix it, then add it to the high-speed mixer, then add 0.01 part of concentrated hydrochloric acid, stir for 30min, and finally add 1 part under ultrasonic (100MHz) A single-layer graphene oxide powder with a sheet diameter of 20-30um is prepared, stirred for 30 minutes, and dried to obtain a graphene-thermally conductive and insulating composite material.

[0042] S2. In parts by weight, add 100 parts of carbonyl iron powder, a conventional magnetic insulating material with a particle size of D50 of 3um, into a high-speed agitator, add 0.1 part of KH-550 to 50 parts of anhydrous ethanol, and add high-speed after mixing. Then add ...

Embodiment 2

[0047] This embodiment provides a graphene thermal interface material integrated with heat conduction and wave absorption.

[0048] The preparation steps are as follows:

[0049] S1. In parts by weight, add 100 parts of silicon nitride with a particle size D50 of 100 nm to a high-speed agitator, add 0.1 part of KH-550 to 10 parts of anhydrous ethanol and add it to a high-speed agitator after mixing, then Then add 0.01 part of concentrated hydrochloric acid, stir for 10min, and finally add 1 part of single-layer graphene oxide with a sheet diameter of 10-20um under ultrasonic (200MHz), stir for 10min, and dry to obtain graphene-thermally conductive insulating composite material.

[0050] S2. In parts by weight, add 100 parts of conventional magnetic insulating material carbonyl nickel powder with a particle size of D50 of 100nm into a high-speed stirrer, add 0.1 part of KH-550 to 10 parts of absolute ethanol and mix and add high-speed Then add 0.01 part of concentrated hydroch...

Embodiment 3

[0055] This embodiment provides a graphene thermal interface material integrated with heat conduction and wave absorption.

[0056] The preparation steps are as follows:

[0057] S1. In parts by weight, add 100 parts of silica with a particle size D50 of 10um to a high-speed agitator, add 5 parts of KH-550 to 50 parts of anhydrous ethanol and add it to a high-speed agitator after mixing, then Then add 1 part of concentrated hydrochloric acid, stir for 30min, and finally add 10 parts of double-layer graphene oxide with a sheet diameter of 90-100um under ultrasonic (500MHz), stir for 30min, and dry to obtain graphene-thermally conductive insulating composite material.

[0058] S2. In parts by weight, add 100 parts of conventional magnetic insulating material ferrite with a particle size D50 of 8um to the high-speed stirrer, add 5 parts of KH-550 to 50 parts of anhydrous ethanol and mix and then add high-speed stirring Then add 1 part of concentrated hydrochloric acid, stir for ...

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Abstract

The invention discloses a heat-conducting and wave-absorbing integrated graphene thermal interface material and a preparation method thereof. Graphene oxide is used as a carrier respectively, and a heat-conducting insulating material and a magnetic insulating material are selected for compounding and reducing with it, which can be used to prepare heat-conducting properties Graphene thermal interface material with excellent and high insulation performance, and its electromagnetic shielding performance absorbs <-20dB at 3-5GHz.

Description

technical field [0001] The invention relates to a graphene thermal interface material integrated with heat conduction and wave absorption and a preparation method thereof, in particular to a graphene thermal interface material with high thermal conductivity, electromagnetic shielding and insulation integration and a preparation method thereof, belonging to graphene thermal conduction shielding materials technical field. Background technique [0002] The introduction of high frequency in the 5G era, the upgrade of hardware components, and the exponential increase in the number of Internet devices and antennas, electromagnetic interference between devices and within the device itself is ubiquitous, and the harm of electromagnetic interference and electromagnetic radiation to electronic equipment is also increasingly serious. At the same time, with the update and upgrade of electronic products, the power consumption of the equipment continues to increase, and the heat generati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/05C08K13/06C08K9/06C08K3/04C08K3/22C08K3/36C08K3/34C08K3/18C08K3/28C09K5/14H05K9/00
CPCC08L83/04C09K5/14H05K9/0081C08K2201/005C08K2003/2227C08L2205/025C08K13/06C08K9/06C08K3/042C08K3/22C08K3/18C08K3/34Y02P20/10
Inventor 姚林刘怡刘明春郑杰
Owner 德阳中碳新材料科技有限公司
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