36results about How to "Has thermal conductivity" patented technology

The invention relates to anti-cracking waterproof mortar belonging to the technical field of construction materials. In order to solve the problem that the existing anti-cracking mortar is low in tensile binding strength and water-immersed tensile binding strength, the invention provides the anti-cracking waterproof mortar. The mortar comprises the following components in percentage by mass: 27-35wt% of cement, 62-70wt% of sand, 2.0-2.5wt% of polymer latex powder, 0.5-1.0wt% of admixture and 0.1-0.2wt% of fatty acid waterproofing agent, wherein the polymer latex powder is selected from one or more of vinyl acetate-ethylene polymerization rubber powder, ethylene/vinyl chloride/vinyl laurate ternary polymerization rubber powder, vinyl acetate/ethylene/higher fatty acid vinyl ester ternary polymerization rubber powder and vinyl acetate-higher fatty acid vinyl ester polymerization rubber powder. The anti-cracking waterproof mortar has the advantages of reasonable distribution ratio, favorable binding strength, water resistance and anti-cracking effect, and low heat conductivity coefficient.

The invention discloses a heat conducting low-halogen flame-retardant pressure-sensitive adhesive and a preparing method thereof. The heat conducting low-halogen flame-retardant pressure-sensitive adhesive is prepared from, by mass, 60-100 parts of acrylate, 10-20 parts of methyl methacrylate, 0.1-10 parts of methacrylic acid, 1-4 parts of benzoyl peroxide, 20-50 parts of solvent, 5-15 parts of coupling agent, 100-300 parts of heat conducting filling and 20-60 parts of flame-retardant substances. The pressure-sensitive adhesive has heat conducting capacity and excellent flame retardance and meets the environment protection requirement.

The invention relates to a high radiating circuit board and production thereof. A metal material is mainly taken as a substrate. The surface of the metal substrate is provided with a buffer layer. An insulating layer is formed on the surface of the buffer layer. The buffer layer can improve adhesiveness between the metal substrate and the insulating layer, and reduce thermal stress simultaneously. The insulating layer provides the surface insulativity required by implanting circuit and heat conducting property is provided to guide heat energy to distribute uniformly, thereby being favorable for the bottom buffer layer and the metal substrate to release heat to outside, further improving radiating efficiency of the circuit board.

The invention discloses a high-insulation one-way heat conducting polyimide film and a preparation method thereof. The high-insulation one-way heat conducting polyimide film is of a double-layer structure and comprises a polyimide heat insulation layer and a polyimide heat conducting layer; the polyimide heat insulation layer is obtained by curing a polyimide heat insulation coating; the polyimide heat insulation coating contains the materials according to the weight percentage: 6-20 % polyimide resin, 30-85 % solvent and 10-60 % heat-insulating filler; the polyimide heat conducting layer is obtained by curing a polyimide heat conducting coating; the polyimide heat conducting coating contains the materials according to the weight percentage: 6-20 % polyimide resin, 30-85 % solvent and 10-60 % heat conducting filler; and the high-insulation one-way heat conducting polyimide film has a high-insulation one-way heat conducting characteristic and can be used as a flexible heating film base material to improve an energy-saving effect. The preparation method comprises the steps: a, preparing the heat insulation coating; b, coating the heat insulation coating on the surface of a glass substrate; c, curing the heat insulation coating at a low temperature; d, preparing the heat conducting coating; e, coating the heat conducting coating on the heat insulation layer; and f, curing the heat conducting coating at a low temperature to obtain the heat conducting layer.

The invention relates to a method for preparing high-heat-conductivity silicon nitride ceramic through normal pressure sintering. The method includes the steps that with the total material mass being100%, 95-70% of silicon nitride powder and 5-30% of sintering aids are evenly mixed to obtain ceramic mixed powder, and the sintering aids are a mixture with TiO2 as a main sintering aid and at leastone of Y2O3, Sc2O3, Sm2O3, Lu2O3, Er2O3, MgO, Mg2Si and MgSiN2 as an auxiliary sintering aid; the obtained ceramic mixed powder is molded to obtain a ceramic biscuit; the obtained ceramic biscuit is subjected to normal pressure sintering under 1600-1800 DEG C, so that dense silicon nitride ceramic is obtained. The method can be used for obtaining the dense silicon nitride ceramic with a certain heat conductivity level and excellent mechanical properties.

The invention discloses a preparation method and an application method of granular activated carbon for xylose decoloring, which belongs to the field of preparation methods and application methods of activated carbon. The preparation method comprises the following steps: (A) preparing raw materials, namely, weighing phosphoric acid method powder activated carbon made from saw dust, an acrylic emulsion and water according to a ratio of acrylic emulsion to phosphoric acid method powder activated carbon to water being (0.37-0.39):1:1; (B) mixing the raw materials, namely, mixing the weighed raw materials and sufficiently stirring till the granules are uniformly mixed; (C) forming granules, namely, extruding the uniformly mixed raw materials to form granules by using a pelletizing machine at the constant temperature of 90 DEG C, so as to make granules with the particle size of 2-5mm, cooling the granules to be 40-50 DEG C, and drying; (E) separating and cooling. The granular activated carbon prepared by using the method is good in adsorption property, high in strength, acid-alkali resisting, recyclable and reusable, the liquid adsorption amount of unit volume is equivalent to that of other granular activated carbons, and the production environment is improved.

The invention belongs to the technical field of ceramic materials, and discloses high-entropy ceramic as well as a preparation method and application thereof. The molecular formula of the high-entropy ceramic is (Me1aMe2bMe3cMe4dMe5eMe6fMe7gMe8h)B2, 0.1</=a</=0.9, 0.1</=b</=0.9, 0.1</=c</=0.9, 0.1</=d</=0.9, 0.1</=e</=0.9, 0.1</=f</= 0.9, 0</=g</=0.9, 0</=h</=0.9, and a+b+c+d+e+f+g+h=1; Me1-Me8 are any 6-8 of Hf, Mo, Zr, Nb, Ti, V, W, Cr and Ta; the high-entropy ceramic is prepared by the following steps of adding any 6-8 of metal oxides HfO2, MoO3, ZrO2, Nb2O5, TiO2, V2O5, WO3, Cr2O3 and Ta2O5, B4C and carbon powder into a solvent, carrying out ball milling and mixing to obtain mixed powder, carrying out compression molding to obtain a blank, heating the blank to 1400-1600 DEG C, heating the obtained high-entropy powder to 1000-1400 DEG C by adopting spark plasma sintering, filling a protective atmosphere, then heating to 1900-2100 DEG C, pressurizing to 10-100 MPa, and calcining to obtain the high-entropy ceramic. The relative density of the high-entropy ceramic is greater than 98%, the hardness is 35-40 GPa, and the thermal conductivity is 0.1-1 W/(mK).

The invention relates to an electric switching device having a housing (2) made of electrically insulating material, wherein current paths (4a, 4b, 4c) associated with three different phases of a three-phase system are provided. Said current paths each comprise a contact region (14) with a contact bridge (6), wherein the current paths are thermally connected to each other via at least one thermalbridge (9, 9a, 9b, 9c) made at least partially of a material that has greater thermal conductivity than the material of the housing or than air.

The invention discloses modified hexagonalboron nitride powder which is HBN@SiO2 core-shell type filler prepared by using a sol-gel method, taking tetraethylortho silicate (TEOS) as a precursor, taking ammonia water as a catalyst, carrying out hydrolysis reaction, and wrapping HBN with SiO2. The invention further discloses application of the modified hexagonalboron nitride powder. The HBN@SiO2 core-shell type filler is dispersed in a resin matrix, is subjected to steps of spreading and gluing, tailoring and stacking with a copper foil and the like, and then is pressed in a vacuum hot press toobtain a copper-clad plate. The HBN@SiO2 core-shell type powder material prepared by the method is excellent in performance, and has quite good application prospect as high-performance copper-clad plate.

The invention discloses a nano-composite film with an infrared absorption function and a manufacturing method and application thereof. The nano-composite film with the infrared absorption function comprises a porous film and an infrared absorption substance; the porous film is of a communicated three-dimensional mesh structure formed by lap joint of nano-fibers, and has the high capillary acting force, and the infrared absorption substance is at least loaded inside the three-dimensional mesh structure of the porous film. The nano-composite film with the infrared absorption function has the wide infrared absorption waveband and the high infrared absorption rate, meanwhile, the cost is low, the preparation technology is simple, large-scale production is easily achieved, the film can be directly used for light filtering, heat insulation and infrared radiation resistance, the nano-composite film can be stacked with the porous film to form a combined structure, the nano-composite film is used for thermal management or infrared detection resistance, and the application prospect is quite wide.

The present invention provides a blank-drawing process of continuous casting machine crystallizer and its special-purpose crystallizer structure. Said process adopts a crystallizer capable of producing enough elastic deformation under the action of external force. When the steel blank is slided downward in the crystallizer, it can make the wide-edge copper plate of crystallizer produce an outward small transverse displacement, and when the steel blank is slided upward in the crystallizer, it can make the wide-edge copper plate of crystallizer produce an inward small transverse displacement, so that it can make crystallizer have large inverted taper and have higher capacity of heat transmission so as to raise blank-drawing speed and quality.

The invention discloses an LED lamp bead which comprises a heat conduction shell provided with an accommodating cavity, a flip chip, a fluorescent sheet and two pins. The two pins are respectively embedded in the accommodating cavity of the heat conduction shell. The flip chip is mounted on the two pins in an attached mode, electrically connected with the two pins respectively, and located in the accommodating cavity. The fluorescent sheet is fixed on the heat conduction shell. According to the LED lamp bead, the technology of the heat conduction shell and the fluorescent sheet is adopted, a resin colloid does not need to be injected in the accommodating cavity to seal the accommodating cavity, therefore, the overall thickness of the LED lamp bead is small, the heat dissipation effect is good, and color drift cannot occur; a wire does not need to be welded to the flip chip, solid crystal glue does not need to be dotted on the flip chip, and therefore the LED lamp can be thinner.

The invention discloses an automatic unloading type closed sound barrier. The automatic unloading type closed sound barrier comprises H-shaped steel stand columns, an H-shaped steel beam plate, a wire harness, a wind speed sensor, a solar cell transparent plate and an automatic unloading type unit plate; the H-shaped steel stand columns support each other to form a frame structure; the H-shaped steel beam plate is installed on the upper portion of the frame structure; the solar cell transparent plate is arranged at the top of the H-shaped steel stand column located on the upper portion; the wind speed sensor is arranged at the top of the solar cell transparent plate; the automatic unloading type unit plate is arranged at the end, located at the bottom, of the H-shaped steel stand column; and a control box and a storage battery are electrically connected with the automatic unloading type unit plate. A sound absorption and insulation unit plate of the sound barrier with the above structure is detachable, rotating power is provided by a direct current motor, electric energy of the direct current motor is provided by the solar cell transparent plate at the top of the closed sound barrier, thus, the load of the sound barrier is increased, and used energy is clean energy, and the sound barrier is environmentally friendly and efficient.

The invention relates to a nuclear fuel sintered body having enhanced thermal conductivity and a method for manufacturing the same. The method comprises the following steps: (a) preparing a mixture comprising oxide nuclear fuel powder and plate-shaped heat-conducting metal powder; and (b) producing a sintered body by molding the plate-shaped heat conducting metal powder in the mixture so that theplate-shaped heat conducting metal powder has an orientation in the horizontal direction and then heat-treating the molded powder.

The invention discloses a flexible, insulating and heat-conducting ribbon. The flexible, insulating and heat-conducting ribbon is produced from, by weight, 70-95 parts of polyphenylene sulfide, 80-95parts of soluble polytetrafluoroethylene, 10-20 parts of polyformaldehyde, 2-5 parts of carbon nanotubes, 20-30 parts of red mud, 5-10 parts of carbon fibers, 2.5-11.5 parts of staple silicon carbidefibers, 13.5-21.5 parts of barium titanate whiskers, 11-27 parts of boron nitride nano-sheets, 1-2 parts of a coupling agent and 1-2 parts of an antioxidant. The flexible, insulating and heat-conducting ribbon disclosed in the invention has the advantages of good insulating and heat-conducting property, high cost performance, low price, good flexibility, comfortableness, stable chemical propertiesand long service life.

The invention discloses a compressive resistant material with the added thermal conductivity and a preparation method of the compressive resistant material and relates to the technical field of home decoration materials. The compressive resistant material is prepared from the following components in parts by weight: 80-120 parts of PE-RT particles and 1-3 parts of copper powder. According to the compressive resistant material and the preparation method provided by the invention, the PE-RT material is added in the copper powder after being dissolved, and a mixture is prepared into a pipe, so that by adding the copper powder in a host material, the compressive resistant material can conduct heat rapidly, and the service life of a product is prolonged; by adding a metal component, the material has part of thermal conductivity and compressive resistance of metal; and as for a radiator pipeline produced from the material and a main body of a product, the compressive resistance and a coefficient of thermal conductivity are greatly improved, the heat dissipation capacity is large, heat waste is little, the energy is saved, and the environment is protected.

The invention discloses a fullerene composite metal material, which comprises a metal base body and a fullerene base body, wherein the metal base body is processed into powder, the fullerene base body is powdery, the powdery fullerene base body is sufficiently mixed with the powdery metal base body, in addition, the mixture of the powdery fullerene base body and the powdery metal base body is heated until the metal base body is in a fusion state, and then, the mixture is cooled; metal materials of the metal base body comprise silver, copper, aluminum, iron, steel or alloy. Through sufficiently mixing the powdery fullerene base body and the powdery metal base body, the novel composite material is formed, heat conducting and heat radiation performance of the fullerene can be simultaneously realized on each surface and at the inside of the novel composite material, the heat conduction and heat radiation performance of the novel composite material is enhanced, the heat inside the product can be effectively radiated out in time, and the performance stability of the product is ensured. The fullerene is uniformly distributed, so the heat conduction and heat radiation performance of the novel composite material is balanced and stable, and a satisfactory effect can be achieved.

The invention relates to an LED lamp bead. The LED lamp bead comprises a heat conduction shell with an accommodating cavity, a flip chip, a fluorescence plate and two tube pins, wherein the two tube pins are embedded in the accommodating cavity of the heat conduction shell; the flip chip attaches to the two tube pins, are electrically connected with the two tube pins, and are positioned in the accommodating cavity; and the fluorescence plate is fixed on the heat conduction shell. For the LED lamp bead, the heat conduction shell and fluorescence plate technologies are adopted, a resin glue bodydoes not need to be poured in the accommodating cavity, thus the integral thickness of the LED lamp bead is enabled to be small, then the heat dissipation effect is good, and the color shift is avoided; and the flip chip does not need wire bonding and dispensing of crystal fixing glue, so that the thickness of the LED lamp bead is enabled to be small.