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High-insulation one-way heat conducting polyimide film and preparation method thereof

A polyimide film, polyimide technology, applied in the direction of coating, etc., to achieve the effect of improving energy-saving performance

Inactive Publication Date: 2017-05-31
DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Among them, the flexible heating film is used as a heating and thermal insulation product. If it has unidirectional heating characteristics, it can significantly improve the energy-saving performance of the heating film. At present, there is no report on the polyimide film with unidirectional heat transfer characteristics.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] The first embodiment is a high-insulation unidirectional heat-conducting polyimide film, which includes a laminated composite polyimide heat-insulating layer and a polyimide heat-conducting layer. The polyimide heat-insulating layer is separated by polyimide. The thermal coating is cured, the thickness of the thermal insulation layer is 6μm -125μm, and the polyimide thermal conductive layer is cured by the polyimide thermal conductive coating, and the thickness of the thermal conductive layer is 6μm -125μm;

[0035] The polyimide heat insulation coating includes the following materials by weight, specifically:

[0036] Polyimide resin 8%

[0037] Dimethylacetamide DMAC 35%

[0038] Hollow glass beads (100nm) 57%;

[0039] The polyimide thermal conductive coating includes the following materials by weight, specifically:

[0040] Polyimide resin 10%

[0041] Dimethylacetamide DMAC 40%

[0042] AlN (500nm) 50%.

[0043] Through the above structure and material ratio design, the thermal...

Embodiment 2

[0052] The second embodiment is a high-insulation unidirectional heat-conducting polyimide film, which includes a laminated composite polyimide heat-insulating layer and a polyimide heat-conducting layer. The polyimide heat-insulating layer is insulated by polyimide The thickness of the heat-insulating layer is 6μm -125μm, and the polyimide heat-conducting layer is cured by polyimide heat-conducting paint. The thickness of the heat-conducting layer is 6μm -125μm;

[0053] The polyimide heat insulation layer includes the following materials in parts by weight, specifically:

[0054] Polyimide resin 12%

[0055] Dimethylacetamide DMAC 30%

[0056] Hollow glass beads (200nm) 58%;

[0057] The polyimide thermal conductive layer includes the following materials in parts by weight, specifically:

[0058] Polyimide resin 10%

[0059] Dimethylacetamide DMAC 40%

[0060] AlN (500nm) 50%.

[0061] Through the above structure and material ratio design, the thermal conductivity of the polyimide therma...

Embodiment 3

[0070] The third embodiment is a high-insulation unidirectional heat-conducting polyimide film, which includes a laminated composite polyimide heat-insulating layer and a polyimide heat-conducting layer. The polyimide heat-insulating layer is insulated by polyimide The thickness of the heat-insulating layer is 6μm -125μm, and the polyimide heat-conducting layer is cured by polyimide heat-conducting paint. The thickness of the heat-conducting layer is 6μm -125μm;

[0071] The polyimide heat insulation layer includes the following materials in parts by weight, specifically:

[0072] Polyimide resin 10%

[0073] Dimethylacetamide DMAC 35%

[0074] Ceramic beads 55%;

[0075] The polyimide thermal conductive layer includes the following materials in parts by weight, specifically:

[0076] Polyimide resin 8%

[0077] Dimethylacetamide DMAC 40%

[0078] SiC (particle size of 500nm) 32%

[0079] BN (particle size is 200nm) 20%.

[0080] Through the above structure and material ratio design, the th...

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Abstract

The invention discloses a high-insulation one-way heat conducting polyimide film and a preparation method thereof. The high-insulation one-way heat conducting polyimide film is of a double-layer structure and comprises a polyimide heat insulation layer and a polyimide heat conducting layer; the polyimide heat insulation layer is obtained by curing a polyimide heat insulation coating; the polyimide heat insulation coating contains the materials according to the weight percentage: 6-20 % polyimide resin, 30-85 % solvent and 10-60 % heat-insulating filler; the polyimide heat conducting layer is obtained by curing a polyimide heat conducting coating; the polyimide heat conducting coating contains the materials according to the weight percentage: 6-20 % polyimide resin, 30-85 % solvent and 10-60 % heat conducting filler; and the high-insulation one-way heat conducting polyimide film has a high-insulation one-way heat conducting characteristic and can be used as a flexible heating film base material to improve an energy-saving effect. The preparation method comprises the steps: a, preparing the heat insulation coating; b, coating the heat insulation coating on the surface of a glass substrate; c, curing the heat insulation coating at a low temperature; d, preparing the heat conducting coating; e, coating the heat conducting coating on the heat insulation layer; and f, curing the heat conducting coating at a low temperature to obtain the heat conducting layer.

Description

Technical field [0001] The invention relates to the technical field of polyimide films, in particular to a high-insulation unidirectional heat-conducting polyimide film and a preparation method thereof. Background technique [0002] Polyimide is widely used as a substrate for flexible circuit boards, flexible heating films, and solar cells because of its excellent heat resistance, mechanical properties, electrical insulation, and flexibility. [0003] Among them, the flexible heating film is used as a heating and thermal insulation product. If it has one-way heating properties, it can significantly improve the energy-saving performance of the heating film. At present, there are no reports about the unidirectional heat transfer characteristics of polyimide film. Summary of the invention [0004] The purpose of the present invention is to provide a high-insulation unidirectional heat-conducting polyimide film for the shortcomings of the prior art. The flexible heating film improves t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/04C09D179/08C09D7/12C08L79/08C08K7/28C08K7/18C08K3/34C08K7/26
CPCC08J7/0427C08J2379/08C08J2479/08C08K3/22C08K3/28C08K3/34C08K3/38C08K7/18C08K7/26C08K7/28C08K2003/2227C08K2003/282C08K2003/385C08K2201/003C08K2201/011C08L2203/16C09D7/61C09D7/68C09D179/08C08L79/08
Inventor 蒋国辉苏冠贤
Owner DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD
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