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High-insulation one-way heat conducting polyimide film and preparation method thereof
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A polyimide film, polyimide technology, applied in the direction of coating, etc., to achieve the effect of improving energy-saving performance
Inactive Publication Date: 2017-05-31
DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD
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Problems solved by technology
[0003] Among them, the flexible heating film is used as a heating and thermal insulation product. If it has unidirectional heating characteristics, it can significantly improve the energy-saving performance of the heating film. At present, there is no report on the polyimide film with unidirectional heat transfer characteristics.
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Embodiment 1
[0034] The first embodiment is a high-insulation unidirectional heat-conducting polyimide film, which includes a laminated composite polyimide heat-insulating layer and a polyimide heat-conducting layer. The polyimide heat-insulating layer is separated by polyimide. The thermal coating is cured, the thickness of the thermal insulation layer is 6μm -125μm, and the polyimide thermal conductive layer is cured by the polyimide thermal conductive coating, and the thickness of the thermal conductive layer is 6μm -125μm;
[0035] The polyimide heat insulation coating includes the following materials by weight, specifically:
[0043] Through the above structure and material ratio design, the thermal...
Embodiment 2
[0052] The second embodiment is a high-insulation unidirectional heat-conducting polyimide film, which includes a laminated composite polyimide heat-insulating layer and a polyimide heat-conducting layer. The polyimide heat-insulating layer is insulated by polyimide The thickness of the heat-insulating layer is 6μm -125μm, and the polyimide heat-conducting layer is cured by polyimide heat-conducting paint. The thickness of the heat-conducting layer is 6μm -125μm;
[0053] The polyimide heat insulation layer includes the following materials in parts by weight, specifically:
[0057] The polyimide thermal conductive layer includes the following materials in parts by weight, specifically:
[0058] Polyimide resin 10%
[0059] Dimethylacetamide DMAC 40%
[0060] AlN (500nm) 50%.
[0061] Through the above structure and material ratio design, the thermal conductivity of the polyimide therma...
Embodiment 3
[0070] The third embodiment is a high-insulation unidirectional heat-conducting polyimide film, which includes a laminated composite polyimide heat-insulating layer and a polyimide heat-conducting layer. The polyimide heat-insulating layer is insulated by polyimide The thickness of the heat-insulating layer is 6μm -125μm, and the polyimide heat-conducting layer is cured by polyimide heat-conducting paint. The thickness of the heat-conducting layer is 6μm -125μm;
[0071] The polyimide heat insulation layer includes the following materials in parts by weight, specifically:
[0075] The polyimide thermal conductive layer includes the following materials in parts by weight, specifically:
[0076] Polyimide resin 8%
[0077] Dimethylacetamide DMAC 40%
[0078] SiC (particle size of 500nm) 32%
[0079] BN (particle size is 200nm) 20%.
[0080] Through the above structure and material ratio design, the th...
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Abstract
The invention discloses a high-insulation one-way heat conductingpolyimide film and a preparation method thereof. The high-insulation one-way heat conductingpolyimide film is of a double-layer structure and comprises a polyimide heat insulation layer and a polyimide heat conducting layer; the polyimide heat insulation layer is obtained by curing a polyimide heat insulation coating; the polyimide heat insulation coating contains the materials according to the weight percentage: 6-20 % polyimide resin, 30-85 % solvent and 10-60 % heat-insulating filler; the polyimide heat conducting layer is obtained by curing a polyimide heat conducting coating; the polyimide heat conducting coating contains the materials according to the weight percentage: 6-20 % polyimide resin, 30-85 % solvent and 10-60 % heat conducting filler; and the high-insulation one-way heat conducting polyimide film has a high-insulation one-way heat conducting characteristic and can be used as a flexible heating film base material to improve an energy-saving effect. The preparation method comprises the steps: a, preparing the heat insulation coating; b, coating the heat insulation coating on the surface of a glass substrate; c, curing the heat insulation coating at a low temperature; d, preparing the heat conducting coating; e, coating the heat conducting coating on the heat insulation layer; and f, curing the heat conducting coating at a low temperature to obtain the heat conducting layer.
Description
Technical field [0001] The invention relates to the technical field of polyimide films, in particular to a high-insulation unidirectional heat-conducting polyimide film and a preparation method thereof. Background technique [0002] Polyimide is widely used as a substrate for flexible circuit boards, flexible heating films, and solar cells because of its excellent heat resistance, mechanical properties, electrical insulation, and flexibility. [0003] Among them, the flexible heating film is used as a heating and thermal insulation product. If it has one-way heating properties, it can significantly improve the energy-saving performance of the heating film. At present, there are no reports about the unidirectional heat transfer characteristics of polyimide film. Summary of the invention [0004] The purpose of the present invention is to provide a high-insulation unidirectional heat-conducting polyimide film for the shortcomings of the prior art. The flexible heating film improves t...
Claims
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Application Information
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