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Heat conducting low-halogen flame-retardant pressure-sensitive adhesive and preparing method thereof

A technology of pressure-sensitive adhesives and heat-conducting fillers, applied in the field of pressure-sensitive adhesives, can solve problems such as non-flammability, failure to meet requirements, and no thermal conductivity of adhesives, etc., to achieve excellent flame-retardant properties, expand the scope of application, and The effect of thermal conductivity

Inactive Publication Date: 2018-05-08
深圳市德镒盟电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Chinese Patent Publication No. CN102746799A discloses a heat-conducting and insulating pressure-sensitive adhesive tape and its preparation method. Although the prepared pressure-sensitive adhesive has heat-conducting and insulating properties, it does not have flame retardancy, so it is safe to use on high-power electronic components. Hidden danger
[0004] Chinese Patent Publication No. CN103865449A discloses a preparation method of a halogen-free flame-retardant pressure-sensitive adhesive to obtain a halogen-free, low-toxicity, and excellent flame-retardant pressure-sensitive adhesive, but the adhesive has no thermal conductivity, which limits its Applications in high-performance electronic components
[0005] According to the existing technical data and practical applications, only when the pressure-sensitive adhesive has both thermal conductivity and flame-retardant properties can it be better used in the current field of electronic components, and there is no potential safety hazard while meeting actual needs. , in order to better serve people's production and life, but the above-mentioned patent application cannot meet the requirements, so it is urgent to improve this

Method used

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preparation example Construction

[0048] The preparation method of the heat-conducting halogen-free flame-retardant pressure-sensitive adhesive realized by the present invention comprises the following steps:

[0049](1), acrylate, methyl methacrylate, methacrylic acid and solvent are added in parts by mass to the reaction flask equipped with reflux condenser, stirrer, thermometer, nitrogen inlet tube and dropping funnel, and stir Heat and feed nitrogen, control the stirring temperature to 75-115°C, the stirring speed to 60-80r / min, and the stirring time to 30-60min.

[0050] (2), the initiator benzoyl peroxide and the solvent are mixed uniformly at 1: 10 and then dripped into the reactor described in step (1) for 2 to 4 times, and the stirring speed is controlled to be 80 to 120r / min, and the reaction The time is 2 to 8 hours, and the material is cooled to about 40°C while stirring to obtain a polyacrylate adhesive.

[0051] (3) Mix and stir micron-scale thermally conductive fillers, nanoscale thermally cond...

Embodiment 1

[0055] (1) Add acrylate, methyl methacrylate, methacrylic acid, and ethyl acetate in parts by mass to an 80°C flask equipped with a reflux condenser, a stirrer, a thermometer, a nitrogen inlet tube, and a separatory funnel Stir for 30min at a speed of 60r / min. Wherein, the addition amount of acrylate, methyl methacrylate, methacrylic acid, ethyl acetate is 60,15,2,10 successively.

[0056] (2), after 1 part of initiator and ethyl acetate are mixed evenly according to the ratio of 1: 10 (parts by mass), divide 2 times into the reaction bottle described in step (1) drop by drop with separating funnel, Control the stirring rate to 100r / min, react for 4 hours, cool at room temperature to about 40°C, and discharge to obtain a polyacrylate pressure-sensitive adhesive.

[0057] (3) Stir the α-Al2O3 filler with a particle size of about 10 μm, the ultrafine α-Al2O3 filler with a particle size of about 100 nm, and fibrous high-thermal conductivity carbon powder in a high-speed dispersi...

Embodiment 2

[0061] (1), acrylate, methyl methacrylate, methacrylic acid, toluene-ethyl acetate mixture (1:1) in parts by mass is added to the Put it into the 75°C reaction bottle of the tube and the separatory funnel, control the rotation speed at 70r / min, and stir for 50min. Among them, the addition amounts of acrylate, methyl methacrylate, methacrylic acid, and toluene-ethyl acetate mixture were 80, 10, 0.1, and 10 in sequence.

[0062] (2), after mixing and stirring 2 parts of initiator benzoyl peroxide and ethyl acetate according to the ratio of 1: 10, divide 3 times into the reaction flask shown in step 1 dropwise with a separatory funnel, Control the speed of the agitator to 80r / min, cool to about 40°C after reacting for 8 hours, and discharge to obtain a polyacrylate pressure-sensitive adhesive.

[0063] (3) Put the heat-conducting spherical α-Al2O3 filler with a particle size of 40 μm and BN of 0.5 μm into the high-speed dispersion powder mixer at a ratio of 10:3, control the sti...

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Abstract

The invention discloses a heat conducting low-halogen flame-retardant pressure-sensitive adhesive and a preparing method thereof. The heat conducting low-halogen flame-retardant pressure-sensitive adhesive is prepared from, by mass, 60-100 parts of acrylate, 10-20 parts of methyl methacrylate, 0.1-10 parts of methacrylic acid, 1-4 parts of benzoyl peroxide, 20-50 parts of solvent, 5-15 parts of coupling agent, 100-300 parts of heat conducting filling and 20-60 parts of flame-retardant substances. The pressure-sensitive adhesive has heat conducting capacity and excellent flame retardance and meets the environment protection requirement.

Description

technical field [0001] The invention belongs to the technical field of pressure-sensitive adhesives, in particular to heat-conducting halogen-free flame-retardant pressure-sensitive adhesives and a preparation method thereof. Background technique [0002] With the continuous development and progress of science and technology, the integration degree of electronic components is getting higher and higher, and the power is getting higher and higher, so the heat emitted by the equipment is also increasing exponentially. In order to ensure the normal operation of various components, it is necessary to The heat output is also increasing, and the heat dissipation requirements for materials are getting higher and higher. In many industries such as electronics, electrical appliances, energy, and automobiles, especially high-tech fields, pressure-sensitive adhesives have replaced riveting as a new generation of bonding materials due to their small weight, high bonding strength, and sim...

Claims

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Application Information

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IPC IPC(8): C09J133/08C09J11/04C09J11/06C08F220/18C08F220/14C08F220/06C09J7/25C09J7/38
CPCC08F220/18C08K5/34922C08K5/521C08K7/06C08K7/18C08K9/06C08K2003/2227C08K2003/282C08K2003/385C08K2201/003C08K2201/011C09J11/04C09J11/06C09J133/064C09J2301/122C09J2301/302C09J2433/00C09J2467/006C08F220/14C08F220/06
Inventor 王永超唐新开
Owner 深圳市德镒盟电子有限公司
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