Chip testing device

Abstract

The invention provides a chip testing device, which is used for testing the electrical performance of a chip to be tested. The device comprises a testing printed circuit board comprising a front surface and a back surface which are oppositely arranged, wherein a chip testing socket is fixed on the front surface, and the chip testing socket is used for inserting a to-be-tested chip; and a supporting structure which is fixed and connected to the back surface of the test printed circuit board and is used for supporting the chip test socket from the back surface. According to the invention, the problem of over-standard warping of the test printed circuit board is solved through the support structure, the influence of the over-standard warping on the test result is reduced, and the machine-hourloss and the production delay are avoided.

Description

technical field

[0001] The invention relates to the field of chip testing, in particular to a chip testing device. Background technique

[0002] When testing the electrical performance of the test chip on the printed circuit board, it is necessary to automatically put the chip to be tested into the chip test socket on the test printed circuit board by a manipulator. The chip test socket usually uses a Pogo Pin test socket. The process of putting the chip to be tested into the chip test socket is to put each pin of the chip into the corresponding pogo pin, and each pin is put into the pogo pin. The pressure on the pogo pins is about 30g when it is medium, and the number of pins of the chip to be tested may be thousands, so when the thousands of pins are put into the pogo pins, the total pressure on all the pogo pins The pressure can reach tens of kilograms, and these weights will concentrate on the test socket for testing the printed circuit board.

[0003] During the high-...

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