Unlock instant, AI-driven research and patent intelligence for your innovation.

Packaging structure for packaging microelectronic chip in fiber product

A technology of chip packaging and fiber products, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problems of not being able to withstand washing, not being suitable for flexible smart wearable devices, not suitable for fine and high-energy wearable electronic devices, etc., to achieve enhanced The effect of washing resistance, good concealment, and best comfort

Pending Publication Date: 2021-01-29
武汉铁鲸科技有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Traditional packaging methods for electronic components and modules in circuit boards (such as Glob-top) are suitable for circuit boards with hard substrates, not suitable for fine and high-energy wearable electronic devices and cannot withstand water washing
Therefore, the traditional method of electronic packaging Glob-top is not suitable for flexible smart wearable devices

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Packaging structure for packaging microelectronic chip in fiber product
  • Packaging structure for packaging microelectronic chip in fiber product
  • Packaging structure for packaging microelectronic chip in fiber product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0038] Such as Figure 1-4 As shown, a packaging structure in which a microelectronic chip is packaged in a fiber product includes a textile yarn 1 and an electronic module 2. The textile yarn 1 is used to wrap the electronic module 2 to form a fiber with the same characteristics as conventional fibers. The electronic module 2 is used to detect the human body and communicate with external devices.

[0039] Preferably, the textile yarn 1 includes wrapping fibers 11, surrounding fibers 12 and carrier fibers 13, the electronic module 2 is loaded on the carrier fibers 13, the surrounding fibers 12 are arranged parallel to the carrier fibers 13, and the The surrounding fiber 12 is disposed on the upper and lower parts of the carrier fiber 13 , and the wrapping fiber 11 wraps the surrounding fiber 12 and the carrier fiber 13 .

[0040] Preferably, the electronic module 2 includes an upper base 3, an electronic chip 4 and a lower base 5, the lower base 5 is arranged in the textile y...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Lengthaaaaaaaaaa
Login to View More

Abstract

The invention relates to the technical field of packaging, in particular to a packaging structure for packaging a microelectronic chip in a fiber product. The packaging structure comprises textile yarns and an electronic module, wherein the textile yarns are used for coating the electronic module to form textile yarns with the same properties as conventional fibers; and the electronic module is used for detecting a human body and forming communication with external equipment. Compared with the prior art, according to the packaging structure, the electronic chip is packaged into the fiber, thestability of the product can be improved through the overall structure, the washing resistance of the electronic module can be effectively enhanced, the electronic module is packaged into the fiber, better comfort can be provided, meanwhile, the electronic chip is hidden in the electronic module, and good concealment is achieved.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to a packaging structure in which a microelectronic chip is packaged in a fiber product. Background technique [0002] Wearable electronic textiles are a new type of product that integrates electronic functions and textile yarns. Electronic textiles need to be stable, reliable, soft and comfortable so as to be indistinguishable from clothing. Electronic textiles belong to portable devices, which are mainly used in fields such as entertainment, military, aerospace, sports and medical health. With the improvement of people's living standards, people's demand for portable, intelligent and functional integration of electronic products is getting higher and higher, and wearable electronic textiles have entered an era of rapid development. [0003] Electronic textiles can provide a wide range of electronic functions, including electronic detection, data processing and user interaction....

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/31H01L23/29
CPCH01L23/29H01L23/3107
Inventor 李璐李梦龙
Owner 武汉铁鲸科技有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com