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Packaging structure for packaging microelectronic chip in fiber product

A technology of chip packaging and fiber products, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problems of not being able to withstand washing, not being suitable for flexible smart wearable devices, not suitable for fine and high-energy wearable electronic devices, etc., to achieve enhanced The effect of washing resistance, good concealment, and best comfort

Pending Publication Date: 2021-01-29
武汉铁鲸科技有限公司
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  • Summary
  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

[0005] Traditional packaging methods for electronic components and modules in circuit boards (such as Glob-top) are suitable for circuit boards with hard substrates, not suitable for fine and high-energy wearable electronic devices and cannot withstand water washing
Therefore, the traditional method of electronic packaging Glob-top is not suitable for flexible smart wearable devices

Method used

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  • Packaging structure for packaging microelectronic chip in fiber product
  • Packaging structure for packaging microelectronic chip in fiber product
  • Packaging structure for packaging microelectronic chip in fiber product

Examples

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Embodiment

[0038] Such as Figure 1-4 As shown, a packaging structure in which a microelectronic chip is packaged in a fiber product includes a textile yarn 1 and an electronic module 2. The textile yarn 1 is used to wrap the electronic module 2 to form a fiber with the same characteristics as conventional fibers. The electronic module 2 is used to detect the human body and communicate with external devices.

[0039] Preferably, the textile yarn 1 includes wrapping fibers 11, surrounding fibers 12 and carrier fibers 13, the electronic module 2 is loaded on the carrier fibers 13, the surrounding fibers 12 are arranged parallel to the carrier fibers 13, and the The surrounding fiber 12 is disposed on the upper and lower parts of the carrier fiber 13 , and the wrapping fiber 11 wraps the surrounding fiber 12 and the carrier fiber 13 .

[0040] Preferably, the electronic module 2 includes an upper base 3, an electronic chip 4 and a lower base 5, the lower base 5 is arranged in the textile y...

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Abstract

The invention relates to the technical field of packaging, in particular to a packaging structure for packaging a microelectronic chip in a fiber product. The packaging structure comprises textile yarns and an electronic module, wherein the textile yarns are used for coating the electronic module to form textile yarns with the same properties as conventional fibers; and the electronic module is used for detecting a human body and forming communication with external equipment. Compared with the prior art, according to the packaging structure, the electronic chip is packaged into the fiber, thestability of the product can be improved through the overall structure, the washing resistance of the electronic module can be effectively enhanced, the electronic module is packaged into the fiber, better comfort can be provided, meanwhile, the electronic chip is hidden in the electronic module, and good concealment is achieved.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to a packaging structure in which a microelectronic chip is packaged in a fiber product. Background technique [0002] Wearable electronic textiles are a new type of product that integrates electronic functions and textile yarns. Electronic textiles need to be stable, reliable, soft and comfortable so as to be indistinguishable from clothing. Electronic textiles belong to portable devices, which are mainly used in fields such as entertainment, military, aerospace, sports and medical health. With the improvement of people's living standards, people's demand for portable, intelligent and functional integration of electronic products is getting higher and higher, and wearable electronic textiles have entered an era of rapid development. [0003] Electronic textiles can provide a wide range of electronic functions, including electronic detection, data processing and user interaction....

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L23/29
CPCH01L23/29H01L23/3107
Inventor 李璐李梦龙
Owner 武汉铁鲸科技有限公司
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