Embedded laminated structure of metal substrate

Abstract

The invention discloses an embedded laminated structure of a metal substrate. The structure comprises an installation plate, a sliding groove is formed in the installation plate, the sliding groove isconnected with a sliding plate, the sliding plate comprises an upper sliding plate body and a lower sliding plate body, the upper sliding plate body and the lower sliding plate body are provided withinstallation grooves, the metal substrate is installed in the installation grooves, and the top of the metal substrate is connected with an insulating layer. Limiting installation plates are connected to the two sides of the metal substrate and the two sides of the insulating layer, limiting grooves are formed in the upper sliding plate and the lower sliding plate, the limiting installation plates are installed in the limiting grooves, limiting columns are connected to the four corners of the bottom of the upper sliding plate, and limiting clamping grooves matched with the limiting columns are formed in the lower sliding plate. A heat conduction groove is formed in one side of the upper sliding plate and one side of the lower sliding plate, a heat conduction block is connected to the heatconduction groove and installed in the sliding groove, a heat conduction plate is connected to the portion, on one side of the heat conduction block, of the installation plate, a radiator is connected to the heat conduction plate, a cover plate is hinged to the installation plate, and a ventilation dustproof net is embedded in the cover plate.

Description

technical field [0001] The invention belongs to the technical field of metal substrates, and in particular relates to a metal substrate embedded laminated structure. Background technique [0002] The metal substrate is mainly used as a metal circuit board material. With the rapid development of the electronics industry, its scope of use has gradually expanded. However, the existing metal substrates on the market currently have poor conductive and insulating effects, resulting in internal buried laminated layers. There are often mutual inductions between currents, etc., causing circuit opening and closing failures, and the internal heat conduction and heat dissipation effects are poor, so that heat accumulation often occurs between internal buried layers, which is easy to cause the internal buried layers of the metal substrate to be burned. accidents, and the existing metal substrate is prone to bending during installation, resulting in a shortened service life. Contents of...

AI Technical Summary

Problems solved by technology

[0002] The metal substrate is mainly used as a metal circuit board material. With the rapid development of the electronics industry, its scope of use has gradually expanded. However, the existing metal substrates on the market currently have poor conductive and insulating effects, resulting in internal buried laminated layers. There are often mutual inductions between currents, etc., causing circuit opening and closing failures, and the internal heat conduction and heat dissipation effects are poor, so that heat accumulation often occurs between internal buried layers, which is easy to cause the internal buried layers of the metal substrate to be burned. accidents, and the existing metal substrate is prone to bending during installation, resulting in a shortened service life

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