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Composite pasting material and manufacturing method of electronic product

A technology of composite sticking and bonding surface, which is used in semiconductor/solid-state device manufacturing, circuits, electrical components, etc.

Active Publication Date: 2021-02-02
ALLIANCE MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The conforming layer has a conforming surface

Method used

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  • Composite pasting material and manufacturing method of electronic product
  • Composite pasting material and manufacturing method of electronic product
  • Composite pasting material and manufacturing method of electronic product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 3

[0078] [Example 1] to [Example 3] and [Comparative Example 1] to [Comparative Example 2]

Embodiment 1

[0079] The composite sheets of [Example 1] to [Example 3] and [Comparative Example 1] to [Comparative Example 2] having the compositions shown in [Table 1] were evaluated. The evaluation items are adhesion and residual glue properties. Adhesion is tested according to the standard test method of JISZ 02378. The nature of the residual glue is to tear it off according to the standard test method of JISZ 0237 8, and judge whether there is residual glue left on the laminated material.

[0080] [Table 1]

[0081]

[0082] In the composite sticking material of [Comparative Example 1], after being torn off, there is still residual glue on the sticking object.

[0083] In the composite sticking material of [Comparative Example 2], no adhesive residue may be left on the sticking material after tearing off. However, due to the low adhesion (less than 500gf / inch), it cannot be tightly attached to the object to be pasted.

Embodiment 6

[0084] [Example 4] to [Example 6] and [Comparative Example 3] to [Comparative Example 4]

[0085] The composite sheets of [Example 4] to [Example 6] and [Comparative Example 3] to [Comparative Example 4] having the compositions shown in [Table 2] were evaluated. Among them, the evaluation item is that the shrinkable layer needs to be curable and moldable. Also, it can be cut after curing and molding without damage or chipping in appearance.

[0086] [Table 2]

[0087]

[0088] In the composite sticking material of [Comparative Example 3], the curing of the heat-shrinkable layer was poor.

[0089] In the composite pasting material of [Comparative Example 4], when the cured and formed heat shrinkable layer is cut, the appearance may be damaged or broken.

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Abstract

The invention provides a composite pasting material which is suitable for being pasted on a semiconductor structure. The composite pasting material comprises a pasting layer and a thermal shrinkage layer. The pasting layer has a bonding surface. The composite pasting material is adapted to be bonded to the semiconductor structure in such a manner that the bonding surface faces the semiconductor structure. The thermal shrinkage layer is arranged on the surface, opposite to the bonding surface, of the pasting layer. The bonding surface of the composite pasting material has a first curvature before heating. The bonding surface of the composite pasting material has a second curvature after the composite pasting material is heated. The first curvature is greater than second curvature. The invention also provides a manufacturing method of the electronic product.

Description

technical field [0001] The invention relates to a manufacturing method of a pasting material and an electronic product, in particular to a composite pasting material and a manufacturing method of an electronic product using the same. Background technique [0002] In recent years, due to the development of integrated circuits (Integrated Circuit; IC) towards high performance, high density, low power consumption and small size, traditional wire bonding (Wire Bonding) packaging and flip chip (Flip Chip) packaging can no longer meet the demand. Recently, Fan-out Wafer Level Package (FOWLP) has been developed and gradually applied to high-end products. This fan-out package mainly cuts the chip and increases the chip pitch, reassembles another chip, and then performs molding and uses the re-distribution layer (Re-Distribution Layer; RDL) process to replace the original substrate-type package. The packaging area accommodates more pins, and integrates multiple functional chips into...

Claims

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Application Information

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IPC IPC(8): C09J7/29C09J7/30H01L21/67H01L21/683
CPCC09J7/29C09J7/30H01L21/6836H01L21/67132C09J2203/326C09J2433/00H01L2221/68304H01L2221/68386
Inventor 陈俊发黄启华王耀萱林钦楷李贞儒
Owner ALLIANCE MATERIAL
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