Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor manufacturing process formula management method and system

A recipe management and process technology technology, applied in the field of semiconductor process recipe management system, can solve problems such as a lot of manpower, setting errors, etc., to achieve the effect of improving efficiency, ensuring accuracy, and saving labor costs

Active Publication Date: 2021-02-02
CHANGXIN MEMORY TECH INC
View PDF13 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when there are hundreds or even more machines, tens of thousands of recipes need to use the RMS function, because each recipe needs to check the comparison item and set the applicable range of recipe parameters before setting To become a GoldenRecipe, setting parameters requires a lot of manpower, and there are hidden dangers of setting errors

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor manufacturing process formula management method and system
  • Semiconductor manufacturing process formula management method and system
  • Semiconductor manufacturing process formula management method and system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0043] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of the specific details being omitted, or other methods, steps, etc. may be adopted. In other instances, well-known technical solutions have not been shown...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a semiconductor manufacturing process formula management method and system, and the formula management method comprises the steps: building a standard data set which comprisesa plurality of groups of reference process data, and each group of reference process data comprises a plurality of preset reference process parameters; establishing a corresponding relationship between each group of reference process data and a plurality of reference machines, wherein each group of reference process data corresponds to one reference machine and one reference formula; obtaining atleast one reference formula; and selecting a formula matched with the reference formula as a target formula, and selecting reference process data corresponding to the target formula as target processdata. According to the semiconductor manufacturing process formula management method and system provided by the invention, the labor cost is saved, the setting efficiency of the formula process parameters is improved, and the setting accuracy of the formula process parameters is ensured.

Description

technical field [0001] The present disclosure relates to the technical field of semiconductor manufacturing, and in particular, to a semiconductor manufacturing process recipe management method and a semiconductor manufacturing process recipe management system. Background technique [0002] In the field of integrated circuit manufacturing, the production process recipe (Recipe) is a file that stores production process information, and its content can include multiple steps in the process of process processing, as well as various process parameter values ​​​​of each step and the duration of the step. These contents is saved on the device side. In the process of semiconductor manufacturing, every production link is inseparable from the recipe, and the equipment can rely on the content of the recipe to complete the processing of materials. It can be seen from this that the production process recipe is the key that directly affects the production quality. [0003] Generally, a ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G05B19/418
CPCG05B19/41875G05B2219/32368
Inventor 黎焕诚
Owner CHANGXIN MEMORY TECH INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com