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Semiconductor device package and acoustic device having the same

A semiconductor and encapsulation technology, which is applied in semiconductor devices, semiconductor electrostatic transducers, semiconductor/solid-state device components, etc., and can solve problems affecting the performance of electronic devices and disadvantages.

Pending Publication Date: 2021-02-02
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the miniaturization of electronic devices can adversely affect the performance of electronic devices

Method used

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  • Semiconductor device package and acoustic device having the same
  • Semiconductor device package and acoustic device having the same
  • Semiconductor device package and acoustic device having the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] figure 1 The layout of the semiconductor device package 1 will be described. The semiconductor device package 1 may have a substrate 20 , a microphone 10 , a controller 11 , a sensor 12 , a connection 13 , a feeding structure 14 , a ground pad 15 and an electronic component 16 .

[0024] The microphone 10, the controller 11, the sensor 12, the connector 13, the feeding structure 14, the ground pad 15 and the electronic component 16 may be formed on the same side of the semiconductor device package 1.

[0025] The microphone 10 is exposed on the substrate 20 . The controller 11 is exposed on the substrate 20 . Sensor 12 is exposed on substrate 20. The connectors 13 are exposed on the substrate 20 . The feed structure 14 is exposed on the substrate 20 . Ground pads 15 are exposed on substrate 20. Electronic components 16 are exposed on substrate 20 . The conductive pad 17 is disposed on the substrate 20 . Conductive pads 18 are disposed on substrate 20. The condu...

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Abstract

A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface oppositethe first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.

Description

technical field [0001] The present disclosure generally relates to a semiconductor device package, and more particularly, the present disclosure relates to an acoustic device having the semiconductor device package. Background technique [0002] As technology advances, various circuits or modules can be integrated into one electronic device, such as an acoustic device (eg, earphones or wireless earphones) to perform multiple functions. However, the miniaturization of electronic devices can adversely affect the performance of electronic devices. Contents of the invention [0003] In some embodiments, the present invention discloses a semiconductor device package. The semiconductor device package includes a first substrate, a first electronic component, an encapsulant, and a feed structure. The substrate has a first surface and a second surface opposite to the first surface. The first electronic component is disposed on the first surface of the substrate. The encapsulant...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/10H01L23/31H01L25/16
CPCH01L25/16H01L23/3107H04R1/1041H04R2201/10H04R1/04H04R19/005H04R2201/003H04R2499/11B81B7/008H04R1/1016
Inventor 黄名韬曾奎皓林弘毅
Owner ADVANCED SEMICON ENG INC