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Metal pattern, and preparation method and preparation device of metal pattern

A metal pattern and preparation device technology, applied in conductive pattern formation, printed circuit manufacturing, electrical components, etc., can solve problems such as oxidative deterioration of low-melting-point metals, and achieve the effect of reducing the degree of oxidative deterioration and improving reliability and stability.

Active Publication Date: 2021-02-02
BEIJING DREAM INK TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of this, an object of the present invention is to propose a method for preparing metal patterns to solve the problem of maintaining low-melting-point metals in a molten state for a long time in the existing printing technology, which easily leads to the problem of oxidative deterioration of low-melting-point metals

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  • Metal pattern, and preparation method and preparation device of metal pattern
  • Metal pattern, and preparation method and preparation device of metal pattern
  • Metal pattern, and preparation method and preparation device of metal pattern

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Embodiment Construction

[0021] The following description and drawings illustrate specific embodiments of the invention sufficiently to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely represent possible variations. Individual components and functions are optional unless explicitly required, and the order of operations may vary. Portions and features of some embodiments may be included in or substituted for those of other embodiments. The scope of embodiments of the present invention includes the full scope of the claims, and all available equivalents of the claims. These embodiments of the present invention may be referred to herein, individually or collectively, by the term "invention", which is for convenience only and is not intended to automatically limit the application if in fact more than one invention is disclosed The scope is any individual invention or inventive concept.

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Abstract

The invention discloses a metal pattern, and a preparation method and a preparation device of the metal pattern, and relates to the technical field of printed electronics. The preparation method comprises the following steps: providing a composite material belt, the composite material belt comprises low-melting-point metal and a material belt substrate for bearing the low-melting-point metal, providing a printing substrate, wherein the surface of the printing substrate is provided with a first region adhered with low-melting-point metal and a second region not adhered with the low-melting-point metal; pressing the composite material belt and the printing substrate, and providing a heat source at the pressing position of the composite material belt and the printing substrate, so that the low-melting-point metal at the pressing position on the composite material belt is melted and adhered to the first region of the printing substrate; and before the low-melting-point metal is solidifiedagain,separating the material belt and the printing substrate, and obtaining a metal pattern attached to the surface of the printing substrate. According to the preparation method, the low-melting-point metal is in a molten state only in a short time, so that the oxidative deterioration degree of the low-melting-point metal in air is greatly reduced, and the reliability and stability of the low-melting-point metal printed metal pattern are effectively improved.

Description

technical field [0001] The invention belongs to the technical field of printed electronics, in particular to a method and device for preparing a metal pattern. Background technique [0002] In the traditional field of printed electronics, the preparation of electronic circuits often requires complicated processes, such as the preparation of etched circuit boards. This preparation process is not only complicated and inefficient, but also accompanied by the generation of toxic waste liquid and gas, which pollutes the environment. Not suitable for preparation of small batch production. Low-melting-point metals are metals or alloys with a low melting point, which can be in a liquid state under appropriate temperature conditions, so as to meet the requirements of paste printing, without the need to use traditional cumbersome exposure and etching processes to prepare printed electronics. Moreover, low-melting point metals also have good electrical conductivity, non-toxic and non-...

Claims

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Application Information

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IPC IPC(8): H05K3/12
CPCH05K3/1258H05K2203/1105
Inventor 于洋
Owner BEIJING DREAM INK TECH CO LTD
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