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Metal pattern, method and device for preparing metal pattern

A metal pattern and preparation device technology, applied in conductive pattern formation, printed circuit manufacturing, printed circuit and other directions, can solve problems such as oxidative deterioration of low melting point metals, and achieve the effect of reducing the degree of oxidative deterioration and improving reliability and stability

Active Publication Date: 2022-03-01
BEIJING DREAM INK TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of this, an object of the present invention is to propose a method for preparing metal patterns to solve the problem of maintaining low-melting-point metals in a molten state for a long time in the existing printing technology, which easily leads to the problem of oxidative deterioration of low-melting-point metals

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  • Metal pattern, method and device for preparing metal pattern
  • Metal pattern, method and device for preparing metal pattern
  • Metal pattern, method and device for preparing metal pattern

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Embodiment Construction

[0021] The following description and the accompanying drawings fully illustrate the specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, process, and other changes. Embodiments only represent possible changes. Unless explicitly requested, separate components and functions are optional, and the order of operation can vary. Some embodiments and features may be included or replaced with partial and characteristics of other embodiments. The scope of the embodiments of the invention includes the entire scope of the claims, and all of the obtained equivalents of the claims. In this paper, these embodiments of the invention may be represented by the term "inventions" separately or in total, which is only for convenience, and if more than one invention is actually disclosed, it is not necessary to automatically limit the application. The range is any single invention or inventive concept. ...

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Abstract

The invention discloses a metal pattern, a metal pattern preparation method and a preparation device, and relates to the technical field of printed electronics. The preparation method includes: providing a composite material tape; the composite material tape contains a low-melting point metal and a material tape substrate bearing the low-melting point metal; providing a printing base; A region and a second region that does not adhere to the low-melting point metal; the two are subjected to a pressing process, and a heat source is provided at the pressing point of the two, so that the low-melting point metal on the composite strip at the pressing point is melted and bonded. Attached to the first area of ​​the printing substrate; before the low-melting point metal is solidified again, the strip and the printing substrate are separated to obtain a metal pattern attached to the surface of the printing substrate. In the preparation method, the low-melting-point metal is only in a molten state for a short time, which greatly reduces the degree of oxidation and deterioration of the low-melting-point metal in air, and effectively improves the reliability and stability of the low-melting-point metal printed metal pattern.

Description

Technical field [0001] The present invention belongs to the field of printing electronics, in particular, a method of preparing a metal pattern and a preparation device. Background technique [0002] In the conventional printing electronics, the preparation of electronic circuits often requires a complex process, such as the preparation of the etching circuit board, not only the process is complex, the efficiency is low, and will be accompanied by the production of the toxic waste liquid, which is contaminated. Not suitable for the preparation of small batch production. Low melting metals are metal or alloys having a low melting point, which can present liquid state under appropriate temperature conditions, thereby achieving the requirements of the slurry printing without the need to use traditional cumbersome exposure, etching process processing preparation printing electron, And the low melting metal also has good conductivity, non-toxic and non-polluting, etc., which makes it ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/12
CPCH05K3/1258H05K2203/1105
Inventor 于洋
Owner BEIJING DREAM INK TECH CO LTD
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