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Electronic equipment

A technology for electronic equipment and housing, applied in the field of electronics, can solve the problems of poor heat dissipation effect, insufficient to alleviate the problem of heat generation of electronic equipment motherboards, etc., and achieve the effect of improving heat dissipation effect

Pending Publication Date: 2021-02-05
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat dissipation effect of the above scheme is not good enough to alleviate the heating problem of the motherboard of the electronic equipment

Method used

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Embodiment Construction

[0020] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

[0021] An embodiment of the present application provides an electronic device. The electronic device can be a smart phone, a tablet computer, etc., and can also be a game device, an AR (Augmented Reality, augmented reality) device, a car device, a data storage device, an audio playback device, a video playback device, a notebook computer, or a desktop computing device. Wait.

[0022] see figure 1 and figure 2 , figure 1 It is a combined front view and rear view schematic di...

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Abstract

The embodiment of the invention provides electronic equipment. The electronic equipment comprises: a shell which is provided with a ventilation opening, wherein the interior of the shell is communicated with the outside through the ventilation opening; a main board arranged in the shell, wherein the main board comprises a heating part; a semiconductor chilling plate arranged in the shell, whereinthe semiconductor chilling plate is provided with a hot end face and a cold end face which are arranged oppositely, and the cold end face is attached to the heating component; and a cooling plate arranged in the shell, wherein the cooling plate is provided with a first face and a second face which are arranged oppositely, at least one part of the first face is attached to the hot end face, the second face is provided with a plurality of cooling fins, and the multiple cooling fins are arranged opposite to the ventilation opening. According to the electronic equipment provided by the embodimentof the invention, the heat dissipation effect of the heating part on the mainboard of the electronic equipment can be improved.

Description

technical field [0001] The present application relates to the field of electronic technology, in particular to an electronic device. Background technique [0002] With the development of electronic technology and the improvement of user needs, electronic devices such as smart phones, tablet computers and notebook computers have more and more functions and higher power consumption, and the heat generation of electronic devices is also becoming more and more serious. VaporChamber (VC) is an ideal solution to solve the heat dissipation problems of various electronic equipment at present. [0003] In related technologies, a vapor chamber is usually installed on the side of the middle frame of the electronic device close to the main board, and the heat generated by the main board of the electronic device is transferred to the vapor chamber through a thermally conductive interface material, and then the heat vapor chamber and the metal middle frame are excellent. Thermal conducti...

Claims

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Application Information

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IPC IPC(8): H05K7/20F25B21/02G06F1/20
CPCH05K7/20445F25B21/02G06F1/203Y02D10/00
Inventor 韦明李勇
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD