Laser lift-off masks

Abstract

Techniques related to laser lift-off masks are disclosed. In some embodiments, masking material is applied to a substrate that is attached to a plurality of semi conductor device sets. More specifically, the masking material is applied to one or more regions of the substrate between the semiconductor device sets. When the semiconductor device sets are embedded in a filling material, the masking material may be situated between the substrate and the filling material. Thus, transmitting light through the substrate toward the semiconductor device sets causes the substrate to become detached fromthe semiconductor device sets. However, the light is at least partially occluded by the masking material.

Description

Background technique [0001] The present disclosure relates generally to semiconductor device fabrication, and more particularly to laser lift-off masks. [0002] Semiconductor devices have become common in electronics to provide benefits such as size reduction, improved durability, and increased efficiency. For example, compared to an incandescent light bulb, a light emitting diode (LED) is typically smaller, lasts several times longer, and converts proportionally more energy into light than heat. Thus, semiconductor devices have even found their way into display systems, such as those found in televisions, computer monitors, laptops, tablets, smartphones, and wearable electronics. In particular, tiny LEDs can be used to form sub-pixels of display systems. However, making such tiny LEDs can be challenging. [0003] For example, some display systems contain tiny LEDs as flip chips. Flip chip fabrication of LEDs often involves laser lift-off (LLO) techniques for separating t...

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Problems solved by technology

However, if the LEDs are thin, they tend to crack when subjected to the LLO technique

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