Microelectromechanical probe and manufacturing method thereof

Abstract

The technical field of the present invention is the field of semiconductor testing, and a micro-electromechanical probe and a manufacturing method are provided. The method includes the steps of: performing magnetron vacuum sputtering metal on the first sacrificial adhesive layer in the double sacrificial adhesive layer located on the carrier plate. Seed layer; Spin-coat photoresist layer on the metal seed layer to form the second sacrificial adhesive layer of the double sacrificial adhesive layer, and make a microelectromechanical probe layer; peel off the first sacrificial adhesive layer by different separation methods glue layer, the metal seed layer and the second sacrificial glue layer to obtain microelectromechanical probes. The invention uses a specially designed double sacrificial layer peeling structure, sputters a metal conductive seed layer between the double sacrificial layers, and adopts metal differential etching and a specially designed primer peeling process during peeling, so that no application is required when the probe and the carrier are peeled off. Mechanical force and metal structure stripping will not produce random additional deformation and stress, improve the uniformity and consistency of large-scale preparation of MEMS probes, and significantly improve the fatigue life of MEMS probes.

Description

technical field [0001] The invention relates to the field of semiconductor testing, in particular to a micro-electromechanical probe and a manufacturing method thereof. Background technique [0002] Existing probe technologies all originated in the last century, but due to process limitations, it is very difficult to manufacture reliable probe cards that meet high density, fine pitch, small size, and good parallelism at the same time. Based on MEMS technology, it is possible to mass-produce micro-nano-sized structures with good consistency and high precision. The application of MEMS technology in probes can break through the limitations of traditional processes, thereby meeting the requirements of high-density, fine-pitch array arrangement and high-frequency testing. need. By combining the test principle and geometry of traditional probes with the advantages of MEMS technology, MEMS probes are being developed as a new generation of probe technology. [0003] Traditional ve...

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Problems solved by technology

[0004] However, in the traditional microelectromechanical probe manufacturing process, the metal seed layer is obtained by evaporation coating. The bonding force between the coating layers is weak. Cracking and delamination are easy to occur under impact. When the probe is separated from the carrier, it is necessary to overcome the bonding stress of the evaporation film layer, resulting in uneven mechanical stress and deformation of the probe body, which reduces the fatigue life of the probe.

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