A chip diode integrated packaging device

Abstract

An integrated packaging device for patch diodes, comprising: a conveying mechanism; a glue tank disposed on one side of the conveying mechanism in the length direction; a chip carrying mechanism comprising a first bracket and two sets of first four-way limiters formed on the first bracket A chip template is installed between each group of first four-way limit plates; the first stroke mechanism is located at one end of the glue tank, including the first lifting mechanism, the first horizontal linear mechanism, and the sticky core board; the jumper carrying mechanism , comprising a second bracket, two sets of second four-way limiting plates formed on the second bracket, a jumper template is installed between each group of second four-way limiting plates; the second stroke mechanism includes a second lifting Mechanism, second horizontal linear mechanism, pneumatic suction cup. Through the setting of the core and jumping film mechanism along the lead frame conveying line, not only the step-by-step continuous conveying of the lead frame can be realized, but also the gluing, core sticking and core loading can be completed efficiently, and then the sticking and jumping can be completed during the transportation sheet, which greatly improves the process efficiency.

Description

technical field [0001] The invention relates to the field of semiconductor components, in particular to ultra-thin chip diode packaging, and in particular to a chip diode integrated packaging device. Background technique [0002] The packaging process of ultra-thin SMD diodes includes steps such as die-attaching / adhesive / intimate, testing, patching / jumpering, welding, heating and curing. Generally, in order to meet the requirements of mass production and high-efficiency production, lead frames are used as carriers. . The lead frame array has multiple rows and columns of functional units, each unit is used to form an ultra-thin diode in the package. Finally, after the packaging is completed, the ribs are punched or cut to obtain a single independent device. [0003] In order to improve production efficiency, it is necessary to use a conveying mechanism to transport the lead frame as a carrier so that each process point can be connected in series. However, the existing metho...

AI Technical Summary

Problems solved by technology

[0003] In order to improve production efficiency, it is necessary to use a conveying mechanism to transport the lead frame as a carrier so that each process point can be connected in series. However, the existing method is not ideal, and there are still relatively independent modes between processes, especially In the core loading process, continuous operations such as viscose, core bonding, and core loading are required. At present, they are all processed separately, and the efficiency is not ideal, and it cannot be connected with the next lead frame, nor can it be connected with the next process. , for this, it is necessary to improve

Images