Unlock instant, AI-driven research and patent intelligence for your innovation.

Method and device for evaluating a statistically distributed measured value in the examination of an element of a photolithography process

A technology of statistical distribution and measurement value, which is applied in the direction of originals for photomechanical processing, exposure devices for photolithography, nuclear methods, etc. It can solve problems such as the complexity of measurement devices or tools, and achieve the effect of improving measurement accuracy

Pending Publication Date: 2021-02-19
CARL ZEISS SMT GMBH
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Contemporary measuring devices or tools for monitoring and repairing lithographic masks, stencils and / or wafers during the process of producing them are very sophisticated in order to take into account the extremes posed by accuracy in the semiconductor industry strict requirements

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for evaluating a statistically distributed measured value in the examination of an element of a photolithography process
  • Method and device for evaluating a statistically distributed measured value in the examination of an element of a photolithography process
  • Method and device for evaluating a statistically distributed measured value in the examination of an element of a photolithography process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0084] In the following, presently preferred embodiments of the method according to the invention and of the device according to the invention are explained in more detail on the basis of measurements for evaluating lithographic masks. The method according to the invention and the device according to the invention can be used to evaluate all types of transmissive and reflective photomasks. Furthermore, the method according to the invention and the device according to the invention can also be used to evaluate measured values ​​originating from templates and / or wafers for nanoimprint lithography. However, the method according to the invention and the device according to the invention are not limited to elements applied to lithographic processes. Rather, they can be used as a whole to evaluate the measured values ​​of high-precision measuring devices that generate a large amount of measurement data, so that machine learning models can be trained with this large amount of measure...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a method (900) for evaluating a statistically distributed measured value (100, 300, 350) in the examination of an element (810) for a photolithography process, comprising thefollowing steps: (a) using a plurality of parameters (730) in a trained model of machine learning (700), the parameters (730) characterizing a state of a measurement environment (880) in a time periodassociated with a measurement of the measured value (100, 300, 350); and (b) executing the trained model of machine learning (700) in order to evaluate the measured value (100, 300, 350).

Description

[0001] This application claims priority from German patent application DE 10 2018 211099.9 filed on July 5, 2018, the entire content of which is hereby incorporated by reference as part of the present disclosure. [0002] 1. Technical field [0003] The invention relates to a method and a device for improving the measurement accuracy of measuring devices used in the field of the semiconductor industry. In particular, the invention relates to methods and apparatus for evaluating statistically distributed measurements in inspecting elements of a lithographic process. [0004] 2. Background technology [0005] Due to increasing integration densities in the semiconductor industry, photolithographic masks have to image smaller and smaller structures on the wafer. The increasing miniaturization of structures on wafers and thus on pattern bearing elements used for wafer exposure, such as photolithographic masks or templates for nanoimprint lithography, has profound implications for i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G03F1/84G06N3/02G03F7/20
CPCG03F1/84G03F7/705G06N20/20G06N20/10G06N5/01G06N7/01G06N3/044G06N20/00G06F17/18
Inventor D.塞德尔A.弗雷塔格C.沃杰克S.托普弗C.施密特C.胡泽曼
Owner CARL ZEISS SMT GMBH