Electronic device

A technology of electronic devices and drive circuits, applied in nonlinear optics, instruments, optics, etc., can solve problems such as unfavorable mass production, intolerance to bending, easy cracking or fragmentation, etc., and achieve the effect of improving dark state light leakage

Pending Publication Date: 2021-02-23
INNOLUX CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the glass substrate has high mechanical strength, it is not easy to thin and not resistant to bending
Even if it is thinned to less than 0.1 millimeter (mm), the glass substrate is easy to crack or break after bending, which is not conducive to mass production

Method used

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Embodiment Construction

[0012] The directional terms mentioned herein, such as "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the drawings. Accordingly, the directional terms used are illustrative, not limiting, of the invention.

[0013] In the drawings, each figure illustrates the general characteristics of methods, structures and / or materials used in particular embodiments. However, these figures should not be interpreted as defining or limiting the scope or nature encompassed by these embodiments. For example, the relative sizes, thicknesses and positions of layers, regions and / or structures may be reduced or exaggerated for clarity.

[0014] In the following embodiments, the same or similar components will use the same or similar symbols, and their redundant description will be omitted. In addition, features in different embodiments can be combined without conflict, and simple equivalent changes and modifications made in accordance with the sp...

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Abstract

The invention provides an electronic device. The electronic device comprises a first plastic substrate, a second plastic substrate, a liquid crystal layer and a first compensation film. The second plastic substrate overlaps the first plastic substrate. The liquid crystal layer is located between the first plastic substrate and the second plastic substrate. The first compensation film is bonded tothe first plastic substrate. A main axis refractive index of the first compensation film comprises nx1, ny1 and nz1, and the nx1 and the ny1 are both smaller than the nz1.

Description

technical field [0001] The present disclosure relates to an electronic device, in particular to a flexible electronic device. Background technique [0002] Traditional electronic devices (such as display devices) mainly use glass substrates to carry components and / or film layers. Although the glass substrate has high mechanical strength, it is not easy to be thinned and not resistant to bending. Even if the glass substrate is thinned to less than 0.1 millimeter (mm), the glass substrate is likely to crack or break after being bent, which is not conducive to mass production. Compared with glass substrates, plastic substrates are easier to thin and resistant to bending. Therefore, an electronic device using a plastic substrate to carry components and / or film layers may have the advantages of lightness, thinness, flexibility, or impact resistance. Contents of the invention [0003] The present disclosure provides an electronic device, which has the advantages of lightness,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13363
CPCG02F1/13363
Inventor 林子翼陈其伟曾宇志赖柜宏
Owner INNOLUX CORP
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