Visual inspection method for defects of transparent packaging IC

A visual detection and defect technology, applied in the detection field, can solve the problems of high work intensity, low detection efficiency, and poor stability of detection results, etc., and achieve the effects of improving production efficiency and production quality, high detection accuracy, and fast detection speed

Active Publication Date: 2021-02-23
高视科技(苏州)股份有限公司
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

[0004] (1) The manual visual inspection method cannot achieve 24h uninterrupted work, and the work intensity of workers is high, which is easy to cause visual fatigue, lead to false detection, and directly reduce the reliability of product detection;
[0005] (2) The quality judgment standard of manual visual inspection is not easy to quantify, resulting in poor stability of test results;
[0006] (3) Due to the small size of IC integrated chips, limited by the recognition ability of human eyes, the detection speed and accuracy of manual visual inspection are low, resulting in low detection efficiency and high labor costs
[0008] However, the detection speed, detection efficiency and detection accuracy of the above-mentioned fast detection method still need to be improved. For this reason, the present invention provides a visual detection method for the defects of transparent packaged ICs

Method used

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  • Visual inspection method for defects of transparent packaging IC
  • Visual inspection method for defects of transparent packaging IC

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Embodiment 1

[0029] see Figure 1-Figure 2 , the visual detection method of the transparent encapsulation IC defect of the present invention, comprises the following steps;

[0030] (1) Place the product to be tested on the testing equipment, and select different visual devices according to the different sides of the product to collect the image information of each side of the product, and upload the collected image information to the processor ;

[0031] (2) After the processor receives the image information, it compares the image information with the standard image of OK products to find out the defective products, and selects the corresponding algorithm for the defects existing in each surface of the product. The process is as follows:

[0032] Firstly, according to the differences in the background on the texture of the image information, the gray level co-occurrence matrix is ​​used to calculate the following four different texture representation features in the image information: ...

Embodiment 2

[0059] The present embodiment describes the visual detection method of the transparent package IC defect of the present invention with a specific case:

[0060] Taking frontal scratches as an example, after the visual device in Example 1 detects that there is a defect on the front of the product, the algorithm can detect the defect in a specific area on the front of the product, but it is not yet sure what kind of defect it is, because There are still defects such as dirt and bubbles on the front. At this time, it can be judged according to the shape of the defect and the change of gray value. For example, air bubbles and scratches will cause the local gray value to increase, and dirt will cause the local gray value to decrease. , and the bubbles are usually round, the scratches are linear, and the dirt has no fixed shape. At this time, if the algorithm judges that the defect causes the local gray value to increase, and the defect is linear, it can be considered that the defec...

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Abstract

The invention discloses a visual inspection method for defects of a transparent package IC, which comprises the following steps of: firstly, placing a product to be inspected on inspection equipment,selecting different visual devices according to different surfaces of the product so as to acquire image information of each surface of the product, and uploading the image information to a processor;wherein the processor compares the image information with a standard image of the OK product, finds out a defective product, and selects a corresponding algorithm for each defect of the product according to the form of the defect in the image; then, extracting defect features of each surface of the product with the defects, and judging the forms and the existing positions of the defects; detecting again through the algorithm to obtain the specific information of the product OK and NG and the defect type of the NG product; and finally, allowing the processor to send the detected product information to the PLC, and allowing the PLC to accurately separate the OK product from the NG product. According to the visual detection method, the transparent packaged IC can be rapidly detected, the detection speed is higher, and the detection efficiency and the detection precision are higher.

Description

technical field [0001] The invention relates to a detection method, in particular to a visual detection method for the defect of a transparent packaged IC. Background technique [0002] Semiconductor integrated circuits are active components such as transistors, diodes, and passive components such as resistors and capacitors, interconnected according to a certain circuit, and "integrated" on a single semiconductor chip to complete specific circuit or system functions. The scale of the IC industry in mainland China is relatively small, accounting for only a small part of the global IC industry. Generally speaking, China's IC industry lags behind the international advanced level in terms of economy and technology. In recent years, the State Council has issued relevant documents on the development of the IC industry, which has stimulated investment in the domestic IC industry to a certain extent, thereby promoting the growth rate of China's IC industry. [0003] At present, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T7/00G06T7/45
CPCG06T7/0004G06T2207/30148G06T7/45
Inventor 邹双盛邹伟金徐武建周波
Owner 高视科技(苏州)股份有限公司
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