The invention discloses a visual inspection method for defects of a transparent package IC, which comprises the following steps of: firstly, placing a product to be inspected on inspection equipment,selecting different visual devices according to different surfaces of the product so as to acquire image information of each surface of the product, and uploading the image information to a processor;wherein the processor compares the image information with a standard image of the OK product, finds out a defective product, and selects a corresponding algorithm for each defect of the product according to the form of the defect in the image; then, extracting defect features of each surface of the product with the defects, and judging the forms and the existing positions of the defects; detecting again through the algorithm to obtain the specific information of the product OK and NG and the defect type of the NG product; and finally, allowing the processor to send the detected product information to the PLC, and allowing the PLC to accurately separate the OK product from the NG product. According to the visual detection method, the transparent packaged IC can be rapidly detected, the detection speed is higher, and the detection efficiency and the detection precision are higher.