Apparatus for treating substrate

A technology for substrate processing equipment and processing space, which is applied in the direction of gaseous chemical plating, coating, electrical components, etc., and can solve problems such as difficult temperature and unevenness

Pending Publication Date: 2021-02-23
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, regions of the substrate are supplied with a non-uniform flow of gas, making it difficult to uniformly regulate the temperature of different regions of the substrate

Method used

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  • Apparatus for treating substrate
  • Apparatus for treating substrate
  • Apparatus for treating substrate

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Embodiment Construction

[0040] Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited by the following embodiments. The purpose of this embodiment is to help those skilled in the art better understand the present invention. Therefore, the shapes of the elements in the drawings are exaggerated to emphasize the description more clearly.

[0041] figure 2 is a perspective view schematically showing a substrate processing apparatus according to an embodiment of the present invention, image 3 to represent figure 2 A cross-sectional view of the substrate processing device of the coating unit or the developing unit, Figure 4 for image 3 A plan view of the substrate processing apparatus. Such as Figure 2 to Figure 4 As shown, the substrate processing apparatus 1 includes an index module (i...

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Abstract

An embodiment of the inventive concept provides an apparatus for treating a substrate. The apparatus for treating a substrate includes a chamber having a treating space inside the chamber and a gas inlet unit entering a gas into the treating space. The gas inlet unit includes an introduction pipe through which the gas is entered, and a discharging plate in which a discharging hole discharging thegas entered through the introduction pipe is formed. The discharging hole is arranged such that density for each area of the discharging plate is different.

Description

[0001] Cross References to Related Applications [0002] This application claims priority and benefit from Korean Patent Application No. 10-2019-0100915 filed with the Korean Intellectual Property Office on August 19, 2019, the entire contents of which are incorporated herein by reference. technical field [0003] The invention relates to a substrate processing device. Background technique [0004] To manufacture semiconductor elements, various processes such as cleaning, deposition, photolithography, etching, and ion implantation are performed. Among these processes, deposition and coating processes are used as processes for forming a film on a substrate. Generally speaking, the deposition process is a process of depositing a process gas on a substrate to form a film, and the coating process is a process of coating a treatment liquid on a substrate to form a liquid film. [0005] Before and after forming a film on the substrate, a process of baking the substrate is perfor...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67017H01L21/67098C23C16/4412C23C16/45565H01L21/6715H01L21/67173H01L21/67178H01L21/67253
Inventor 李承汉崔从洙徐钟锡徐准浩郑煐宪徐庚进李政炫裵文炯裵相真
Owner SEMES CO LTD
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