Heat exchange module and electronic device using the same

Abstract

The invention relates to an electronic device, which comprises an electronic device body and a heat exchange module. The electronic device body is provided with a top, which is provided with an innerwall; the heat exchange module is arranged at the top in the electronic device body and comprises a plurality of first channels and a plurality of second channels; wherein the plurality of first channels are applied to be communicated with the outside of the electronic device to serve as a part of an external circulation path and allow external circulation airflow to pass through the first channels, and the airflow inlet direction and the airflow outlet direction of the first channels are the same; one end of each second channel abuts against the inner wall, so that a single-side opening is formed in each second channel, the airflow inlet direction and the airflow outlet direction of each second channel are parallel and opposite, and the airflow inlet direction and the airflow outlet direction of each second channel are perpendicular to the airflow inlet direction and the airflow outlet direction of the first channel.

Description

technical field [0001] The invention relates to a heat exchange module and an electronic device using the same, in particular to a heat exchange module capable of reducing assembly time and cost and an electronic device using the same. Background technique [0002] With the development of the electronic industry, the requirements for the operation speed and effect of the electronic device body are increasing day by day. However, the heat dissipation problem derived from it is becoming more and more serious, which further affects the performance and stability during operation. In order to ensure the normal operation of the electronic device, a heat dissipation device is generally installed on the body of the heat-generating electronic device, and the heat energy is dissipated by the heat dissipation device. [0003] Wherein, the heat cannot be dissipated immediately and effectively only by passive heat dissipation, so the electronic device is usually equipped with a cooling d...

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Problems solved by technology

[0004] The heat exchange module D2 of the known heat exchange device D is arranged as a heat dissipation core with a casing D7 containing a plurality of heat dissipation aluminum sheets A (such as Figure 1C ), however, the heat dissipation aluminum sheet A must be bent by a machine or stamped by a mold, and then stacked by rotating 180 degrees after applying glue on the L-shaped edge. The assembly process is more complicated and time-consuming; The thin aluminum sheet used has insufficient rigidity, is easy to bend and deform, and is very easy to cause displacement or inclination in the case when the glue is not dry, which leads to the quality of the heat dissipation core formed by the combination of known thin aluminum sheets. less stable

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