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COB novel light source package with strong one-time heat dissipation capability

A heat dissipation capability and light source sealing technology, which is applied in the direction of light sources, cooling/heating devices of lighting devices, lighting devices, etc., can solve the problems of not having primary heat dissipation function, reducing the service life of the package, and increasing the internal temperature of the package, so as to prevent internal The effect of LED lamp damage, prolonging the service life, and reducing the internal temperature

Pending Publication Date: 2021-02-26
CECEP (JIASHAN) ENVIRONMENTAL PROTECTION TECH PARK DEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a new COB light source package with strong primary heat dissipation capability, so as to solve the problem that the existing COB new light source package proposed in the above background technology has poor heat dissipation performance and does not have primary heat dissipation during use. function, causing a large amount of heat to be easily stored inside the package, resulting in an increase in the internal temperature of the package, resulting in damage to the internal LED lamp and reducing the service life of the package

Method used

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  • COB novel light source package with strong one-time heat dissipation capability
  • COB novel light source package with strong one-time heat dissipation capability
  • COB novel light source package with strong one-time heat dissipation capability

Examples

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Comparison scheme
Effect test

Embodiment 1

[0026] see Figure 1-5 , the present invention provides a technical solution: a new COB light source package with strong heat dissipation capability at one time, including an aluminum package base 1, a base 2 and a glass cover 6, and the bottom of the inner cavity of the aluminum package base 1 is fixedly installed with a first Radiating box 18, the inside of the top wall of the first cooling box 18 is fixedly equipped with a heat conduction block 19, the inside of the aluminum package seat 1 is installed with a high-voltage ceramic plate 20, the inside of the bottom of the high-voltage ceramic plate 20 is fixedly installed with a heat conduction plate 25, and the high-voltage ceramic A plurality of lamp holders 14 are fixedly installed on the top of the board 20, LED lamps 15 are installed inside the plurality of lamp holders 14, a second heat sink 10 is fixedly installed on the top of the high-voltage ceramic board 20, and the inside of the aluminum package holder 1 is fixed ...

Embodiment 2

[0029] see Figure 1-5 , on the basis of Embodiment 1, the present invention provides a technical solution: the bottom of the inner cavity of the aluminum package seat 1 is fixedly installed with four support slot columns 21, and the bottom of the high-voltage ceramic plate 20 is fixedly installed with four inserts 22, and the positions of the four plug-in blocks 22 correspond to the positions of the four supporting slot columns 21, the inside of the four supporting slot columns 21 are provided with slots, and the specifications and sizes of the plug-in blocks 22 are the same as those of the slots. match, and the insert block 22 is plugged into the inside of the card slot.

[0030] In this embodiment, the high-voltage ceramic board 20 can be installed inside the aluminum package base 1 by inserting the four inserts 22 into the slots inside the four supporting slot columns 21 .

Embodiment 3

[0032] see Figure 1-5 , On the basis of Embodiment 1 and Embodiment 2, the present invention provides a technical solution: a plurality of circular holes 3 are opened inside the second heat dissipation box 10, and a plurality of lamp holders 14 are respectively located in the plurality of circular holes 3 internal.

[0033] In this embodiment, the second cooling box 10 can absorb the heat generated by the luminous LED lamp 15. The material used in the second cooling box 10 is aluminum or copper with strong thermal conductivity. The heat generated by the LED lamp 15 during work The heat will be conducted through the wall of the second heat dissipation tank 10 , and the heat will be transferred to the cooling liquid inside the second heat dissipation tank 10 , and the cooling liquid will absorb the heat.

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Abstract

The invention discloses a COB novel light source package with strong one-time heat dissipation capability. The package comprises an aluminum package base, a base and a glass sealing cover, a first heat dissipation box is fixedly installed at the bottom of an inner cavity of the aluminum package base, a heat conduction block is fixedly installed in the top wall of the first heat dissipation box, ahigh-voltage ceramic plate is installed in the aluminum package base, a heat conduction plate is fixedly installed in the bottom of the high-voltage ceramic plate, a plurality of lamp holders are fixedly installed at the top of the high-voltage ceramic plate, LED lamps are installed in the lamp holders, and a second heat dissipation box is fixedly installed at the top of the high-voltage ceramic plate. The cooling liquid absorbing excessive heat in the first heat dissipation box and the second heat dissipation box can be replaced through a liquid pump and a cooling liquid box, and the coolingliquid absorbing excessive heat is replaced with a cooling liquid with lower temperature, so that the heat dissipation of the interior of the package is realized at one time, the heat dissipation effect is good, the internal temperature of the COB package is reduced, the internal LED lamps are prevented from being damaged, and the service life of the package is prolonged.

Description

technical field [0001] The invention belongs to the technical field of COB light sources, and in particular relates to a new COB light source packaging with strong primary heat dissipation capability. Background technique [0002] With the rapid development of LED technology, LED has been applied in almost every industry, and has gradually become an emerging light source to replace traditional lighting sources. At present, in order to meet the needs of different application fields, LED packaging technology is constantly improving, and the packaging forms are becoming more and more diversified. Among them, COB is a kind of LED packaging form, and COB is a way to directly package chips into integrated circuits. The method is to directly stick the bare chip on the circuit board or substrate, and combine the three basic manufacturing methods of chip bonding wire or electrode connection and application of sealing technology to effectively transfer the packaging and testing steps ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21K9/20F21V29/58F21V29/70F21V29/89F21Y115/10
CPCF21K9/20F21V29/59F21V29/70F21V29/89F21Y2115/10
Inventor 周建旺
Owner CECEP (JIASHAN) ENVIRONMENTAL PROTECTION TECH PARK DEV CO LTD