A device and method for measuring thermal adaptation coefficient of materials under low air pressure

Abstract

The invention discloses a device and a method for measuring thermal adaptability coefficient of materials at low air pressure. The device includes two chambers with the same structure and different inner diameters. The chambers include conductive filaments, a top cover, a chamber wall and a bottom cover; the top cover is provided with a pipe; the chamber wall is radially provided with a second The first to fourth support rods all extend to the center of the chamber; the end of the support rod is provided with a collar; the conductive filament runs through the four collars; the first support rod and the fourth support rod are provided with wires; Pass through the chamber wall and connect to the DC power supply, and the inner end is connected to the conductive filament; the second support rod and the third support rod are provided with a wire; the outer end of the wire is connected to the voltmeter, and the inner end is connected to the conductive filament; The chamber wall is provided with a pressure gauge; the temperature measuring element, the pressure gauge and the voltmeter are all connected to the computer. The device is used to collect relevant data at low pressure, fit the data curve, and calculate the thermal adaptability coefficient. The method has high measurement precision and good reliability.

Description

technical field [0001] The invention belongs to the technical field of thermodynamic parameter measurement, in particular to a device and method for measuring the thermal adaptation coefficient between gas and solid. Background technique [0002] The thermal adaptability coefficient is a physical parameter representing the degree of energy exchange between solid and gas, that is, the complete degree of energy exchange when gas molecules collide with a solid wall, and it also has broad application prospects in engineering applications. In the field of aerospace, the thermal adaptation coefficient of gas molecules is used to accurately calculate the life of a spacecraft operating in space; the thermal adaptation coefficient is also very important when it comes to heat transfer between gas and solid. Therefore, it is of great significance to accurately obtain the thermal adaptation coefficient for heat exchange analysis in engineering applications. [0003] At this stage, the ...

AI Technical Summary

Problems solved by technology

This method can calculate the thermal adaptation coefficient of the wall surface through numerical simulation, but the molecular dynamics theory has the problems of large calculation amount and small calculation domain, and cannot be directly applied to the case of a large analysis domain, for example, it cannot be directly applied to spacecraft , to obtain the thermal adaptation coefficient of the spacecraft surface; at the same time, the fitting results may be quite different from the orbital test results, and multiple feedback corrections are required

Images