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Packaging body and preparation method thereof

A package and plastic package technology, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve the problem that the flat chip packaging method cannot meet the demand, and achieve a small degree of deformation and warpage. Accurate, Realizing Package Size Effects

Pending Publication Date: 2021-03-05
SKY CHIP INTERCONNECTION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In recent years, with the rapid development of high-density, multi-functional, and miniaturized chip packaging, the packaging method of chip tiles can no longer meet the demand. In view of this, the packaging structure of chip stacking has appeared

Method used

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  • Packaging body and preparation method thereof
  • Packaging body and preparation method thereof
  • Packaging body and preparation method thereof

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Experimental program
Comparison scheme
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Embodiment Construction

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0017] refer to figure 1 , figure 1 It is a schematic flow chart of an embodiment of a method for preparing a package of the present application. combine figure 2 , the preparation method of the package comprises:

[0018] S110: Prepare a package semi-finished product 1000, wherein the package semi-finished product 1000 includes a substrate 1100, a first device 1200, a second device 1300, a first plastic package 1400 and a second plastic package 1500, and ...

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Abstract

The invention discloses a packaging body and a preparation method thereof. The preparation method of the packaging body comprises the steps: preparing a packaging semi-finished product, wherein the packaging semi-finished product comprises a substrate, a first device, a second device, a first plastic packaging body and a second plastic packaging body, the first device and the second device are arranged on the first surface and the second surface of the substrate respectively, and the first plastic package body and the second plastic package body respectively wrap the first device and the second device on the substrate; fixing a plurality of packaged semi-finished products on the same side of the first support plate, with exposed pins of the second device facing the first support plate; placing a middle-layer bracket and a second supporting plate; laminating the first support plate, the second support plate, the intermediate layer bracket and the plurality of packaging semi-finished products to form an integral structure; and processing the first support plate to form a bonding pad connected with the pin of the second device. According to the preparation method provided by the invention, the alignment problem in the preparation process of the packaging body can be solved, and the size miniaturization of the packaging body can also be realized.

Description

technical field [0001] The present application relates to the technical field of packaging, in particular to a packaging body and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of high-density, multi-functional, and miniaturized chip packaging, the flat chip packaging method can no longer meet the demand. In view of this, a chip stack packaging structure has emerged. [0003] The inventors of the present application have found that in the current packaging structure of chip stacks, especially for high-power modules, flow capacity, heat dissipation and high reliability have become technical difficulties in the industry. Contents of the invention [0004] The technical problem mainly solved by this application is to provide a package and its preparation method, which can not only solve the alignment problem in the process of preparing the package, but also realize the miniaturization of the package. [0005] In order ...

Claims

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Application Information

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IPC IPC(8): H01L21/56H01L21/48H01L23/498H01L23/31H01L23/367H01L21/60
CPCH01L21/563H01L23/49827H01L21/486H01L23/3121H01L23/367H01L2224/0231H01L2224/02381H01L2224/48091H01L2224/16H01L2224/97H01L2924/181H01L23/498H01L21/48H01L21/56H01L23/31H01L25/16H01L2924/00014H01L2924/00012
Inventor 郭文龙张强波宋关强柳仁辉余晋磊
Owner SKY CHIP INTERCONNECTION TECH CO LTD