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Manufacturing and using method of anti-overflow mold for silica gel encapsulation

A technology of anti-overflow and silicone gel, which is applied in the field of anti-overflow mold production, can solve the problems of large size error of potting body, large error of plate material thickness, viscous glue, etc., so as to solve the problem of sealing and overflow , saving production costs, making simple effects

Pending Publication Date: 2021-03-09
LUOYANG LONGSHENG SCI & TECH
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  • Application Information

AI Technical Summary

Problems solved by technology

[0006] 1. Due to the viscous glue during potting, it is not easy to control the amount of filling in time and effectively, and it is easy to make the potting glue overflow the mold. During the vacuum defoaming operation, the liquid level of the potting glue will also change with the rise of the bubbles when the bubbles are discharged. , will also cause the potting compound to overflow
[0007] 2. The potting mold is usually processed from various non-metallic material plates, and the thickness error of the plate material is large. During the installation and manufacture of the potting mold, due to the influence of the thickness error of the mold plate, the volume of the cured potting body has a large error

Method used

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  • Manufacturing and using method of anti-overflow mold for silica gel encapsulation
  • Manufacturing and using method of anti-overflow mold for silica gel encapsulation
  • Manufacturing and using method of anti-overflow mold for silica gel encapsulation

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Embodiment Construction

[0026] The present invention will be further explained below in conjunction with the accompanying drawings and examples, and the protection scope of the present invention cannot be limited by this. The purpose of disclosing the present invention is to protect all technical improvements within the scope of the present invention.

[0027] combined with Figure 1-3 A method for making and using an anti-spill mold for silicone gel potting, taking the production of a potting body with a length×width×height of 50mm×50mm×60mm as an example, the specific steps are:

[0028] Step 1: According to the required length and width of the potting body, select a hexahedron forming mold tooling with a length × width of 50mm × 50mm and unlimited height; select a transparent acrylic sheet of non-metallic material as the forming mold 1 and the overflow prevention mold 2's crafting materials.

[0029] Step 2: Making the forming mold 1: According to the required height of the potting body, select f...

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Abstract

The invention discloses a manufacturing and using method of an anti-overflow mold for silica gel encapsulation. The sealing problem and the overflow problem during silica gel vacuum encapsulation areeffectively solved. Four side plates of a forming mold are sequentially and vertically connected with the plate surface end to end, so that the influence caused by the thickness error of a mold platecan be eliminated, and the volume of an encapsulation body formed after an encapsulation adhesive is cured is accurately controlled; and manufacturing is easy, demolding is easy, repeated use is achieved, and the production cost is saved.

Description

technical field [0001] The invention relates to the technical field of precise forming molds for potting parts, in particular to a method for making and using an anti-overflow mold for silicone gel potting. Background technique [0002] The military power supply is used in a harsh environment, and the components and printed board components in the power supply must be protected against mold, salt spray, and moisture. In addition to using dipping paint and other methods of protection, using potting glue to potting devices and printed board components is also an effective means of three-proof protection. After the potting glue is cured, it can completely cover the devices and printed boards, effectively Isolate the influence of external environmental factors. At the same time, the potting operation is also an effective means of insulation protection for high-voltage devices. After the high-voltage circuit is potted, the cured colloid can adhere to the high-voltage device to f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C39/10B29C39/26B29C39/42
CPCB29C39/10B29C39/26B29C39/42
Inventor 代大志
Owner LUOYANG LONGSHENG SCI & TECH
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