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Vertical chip for connection

A chip and connector technology, which is applied to printed circuits, semiconductor/solid-state device components, semiconductor devices, etc. connected with non-printed electrical components, can solve the problem of occupying too much PCB area, reduce the occupied area, The effect of reducing the size

Active Publication Date: 2021-03-09
SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, the purpose of the present invention is to propose a vertical chip for connection to solve the problem that the connection between the PCB and the product box occupies too much PCB area in the prior art

Method used

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  • Vertical chip for connection
  • Vertical chip for connection
  • Vertical chip for connection

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Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0024] It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are used to distinguish two entities with the same name or different parameters. It can be seen that "first" and "second" " is only for the convenience of expression, and should not be understood as limiting the embodiment of the present invention. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion, for example, of a process, method, system, product or other steps or elements inherent in a process, method, system, product, or device comprising a series of steps or elements.

[0025] It should also be noted ...

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PUM

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Abstract

The invention provides a vertical chip for connection. The vertical chip comprises a chip main body and a connecting main body, The chip main body comprises a chip body and pins which are arranged onthe chip body and can extend and retract in the direction vertical to the central axis of the chip body; the connecting main body comprises a connecting piece and a pressing cap arranged at the top ofthe connecting piece; the middle part of the connecting piece is used for accommodating an accommodating cavity of the chip body; the connecting piece comprises a through hole formed in the side wallof the connecting piece, and the pin extends to penetrate through the through hole to be connected with a connecting contact of the PCB; and the pressing cap comprises a driving piece used for driving the pin to stretch out and draw back. According to the vertical chip for connection and the manufacturing method thereof provided by the invention, the vertical chip for connection not only plays arole of the chip, but also can be used for connecting a PCB, a case and other connected objects, so that the area occupied by connecting holes in the PCB is effectively reduced, and the size of the case and the like can be reduced; nd athe pressing cap is provided with the driving piece used for driving the pin to stretch out and draw back, so that the connecting piece is prevented from penetrating through the PCB, and the use is more flexible and convenient.

Description

technical field [0001] The invention relates to the field of chip technology, in particular to a vertical chip for connection. Background technique [0002] With the development of cloud computing applications, informatization has gradually covered all fields of society. People communicate more and more through the network in their daily work and life. The amount of network data is also increasing, and the performance requirements for servers are also higher. Although the chips in the server board use a large number of BGA packages (ball grid array packages, that is, the soldering surface of the chip is directly below and there are solder balls arranged in an array) to reduce space, the PCB surface space is limited, which limits the space of the server. Board design. At present, more than 95% of the boards need to be fixed on the chassis by screws, and the corresponding screw holes are designed on the boards, which seriously occupies the area of ​​the boards, thereby increa...

Claims

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Application Information

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IPC IPC(8): H01L23/04H01L23/48H05K1/18
CPCH01L23/04H01L23/48H05K1/181
Inventor 陈峰跃
Owner SUZHOU LANGCHAO INTELLIGENT TECH CO LTD