A circuit board welding method, circuit board and electronic equipment

Abstract

The invention discloses a circuit board welding method, a circuit board and electronic equipment. The method includes: heating and cleaning the soldering iron tip; moving the soldering iron tip from an original position to a first position, wherein the distance between the first position and the soldering point is a first preset distance; controlling the soldering iron tip according to the first position. Tin out at a preset time; move the soldering iron head that has finished tinning to the welding point, and control the soldering iron head to perform ultrasonic welding at the soldering point at the first preset frequency and the first preset amplitude for the second preset time; welding is completed and then lower the amplitude and frequency of the soldering iron tip; move the soldering iron tip to a second position at a first preset speed, and move the soldering iron tip from a second position to an original position at a second preset speed, wherein the second position The distance from the welding point is a second preset distance, and the second preset speed is greater than the first preset speed. The solution of the invention can avoid generation of solder balls, improve production efficiency and reduce production cost.

Description

technical field [0001] The invention relates to the field of ultrasonic welding, in particular to a circuit board welding method, a circuit board and electronic equipment. Background technique [0002] Servers, computers, hard disks, GPUs, etc. contain various circuit board structures, and various components are welded on the circuit boards to achieve different functions. For example, hundreds of electronic components are soldered on servers and computer motherboards. These components often have strict requirements during the soldering process. For example, in order to prevent the series / parallel between components from being damaged or losing their original functions, solder balls cannot be generated during soldering. ; In addition, the solder balls are easy to vibrate at will during the working process of the server and cause the short circuit of the motherboard. Due to the small size of the solder balls, it is difficult to find and clean up all the solder balls during the...

AI Technical Summary

Problems solved by technology

For example, servers and computer motherboards are soldered with thousands of electronic components. These components often have strict requirements during the soldering process. For example, in order to prevent the serial / parallel connection between components from being damaged or losing their original functions, solder balls cannot be produced during soldering. ;In addition, solder balls are easy to vibrate randomly during the working process of the server and cause a short circuit on the motherboard. Due to the small size of such solder balls, it is difficult to find and clean them all during the soldering process, which brings greater safety and performance to electronic equipment. Hidden dangers, and even lead to abnormal operation of the entire equipment, so the welding process is particularly important

[0003] At present, the traditional soldering process is still difficult to avoid the generation of solder balls. It can only be inspected and cleaned by manual or CCD visual inspection technology after the soldering is completed. This method cannot solve the problem of solder balls generated by welding from the root. , there is an incomplete cleaning process, and at the same time, it also increases the inspection investment in welding production, which makes the production cost higher

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