Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Repair circuit and method and electronic equipment

A technology for repairing circuits and circuits, which is applied in circuit devices, electronic circuit testing, emergency protection circuit devices, etc., and can solve problems such as users being unable to operate other functions of mobile phones and users being unable to use mobile phones

Pending Publication Date: 2021-03-12
VIVO MOBILE COMM CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In many mobile phones, because the "volume down" operation is always displayed, the user cannot operate other functions of the mobile phone, resulting in the user being unable to use the entire mobile phone

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Repair circuit and method and electronic equipment
  • Repair circuit and method and electronic equipment
  • Repair circuit and method and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0047] Embodiments of the present invention will be described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0048] The features of the terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of these features. In the description of the present invention, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a repair circuit and method and electronic equipment. The repair circuit comprises a detection circuit, an isolation circuit and a fusing circuit, wherein the detection circuitis connected with the isolation circuit and the fusing circuit, and a target circuit is connected with the detection circuit, the isolation circuit and the fusing circuit. When the detection circuitdetects that there is a dendritic crystal fault in the target circuit, the detection circuit controls the isolation circuit to isolate the target circuit; and under the condition that the target circuit is isolated, the detection circuit controls the fusing circuit to output fusing current to the target circuit so as to fuse the dendrites in the target circuit.

Description

technical field [0001] The application belongs to the technical field of hardware circuits, and in particular relates to a repair circuit, a repair method for button failure and electronic equipment. Background technique [0002] In the related art, the so-called dendrite refers to a dendritic structure formed by precipitated metal or its oxide in the circuit board. Generally, in a charged circuit board, if there is moisture intrusion into the circuit board and there are metal ions in the circuit board, then dendrite phenomenon may be induced in the circuit board. [0003] The inventors of the present application have found that as the circuit design becomes more and more miniaturized, the dendrites in the circuit board can easily short-circuit the circuit, thereby causing hardware failure. Due to the small structure of the circuit, it is very difficult to detect and repair faulty hardware components. For example, dendrites may appear in multiple places in a circuit board,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28H02H3/06H02H7/20
CPCG01R31/2843H02H7/20H02H3/066
Inventor 郑嘉伟
Owner VIVO MOBILE COMM CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com