Chip packaging system

Abstract

The invention discloses a chip packaging system which comprises a base, a vertical plate is fixedly connected to the position, close to the rear side, of the top of the base, a first motor is installed on the rear side face of the vertical plate, an output shaft of the first motor penetrates through the vertical plate and is fixedly connected with an outer cylinder, an opening in the top end of the outer cylinder and an opening in the middle of one side of the outer cylinder; a strip-shaped outlet is formed in the outer cylinder at the bottom of the middle opening; according to the invention,the outer cylinder is in a horizontal state, the worker for placing the shell is on one side, the worker for placing the chip is in the middle, and the worker for gluing and taking out the chip is onthe other side, so that the station layout is more reasonable and each one performs own functions, and the chip and the shell can be placed in the outer cylinder at the same time, and then the outer cylinder is rotated to a vertical state and when the outer cylinder is vertically arranged, smearing of glue solution will not be affected; and meanwhile, the semicircular plate is in an initial heating state in the smearing process, after smearing is completed, the shell and the chip are made to quickly get close to the heating element, and the packaging efficiency is improved through mutual cooperation of all the processes.

Description

technical field [0001] The invention belongs to the technical field of chip packaging, in particular to a chip packaging system. Background technique [0002] The shell used to install the semiconductor integrated circuit chip plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, and it is also a bridge to communicate the internal world of the chip with the external circuit - the contacts on the chip are connected to the packaging shell with wires On the pins, these pins are connected to other devices through the wires on the printed board. Therefore, packaging plays an important role for both CPUs and other LSI integrated circuits. [0003] When packaging the chip, it is necessary to apply glue between the chip and the shell and then heat seal it. When the chip and the shell are assembled and heat-sealed in the horizontal direction, the glue is not easy to apply. When the chip and the shell are assembled in the vertic...

AI Technical Summary

Problems solved by technology

[0003] When packaging the chip, it is necessary to apply glue between the chip and the shell and then heat seal it. When the chip and the shell are assembled and heat-sealed in the horizontal direction, the glue is not easy to apply. When the chip and the shell are assembled in the vertical direction and heat-sealed, It is necessary to apply glue on the surface of the chip before placing the shell. It is impossible to put both at the same time, which may easily cause the late-placed parts to not be put in in time, which not only affects the efficiency of packaging, but also causes the loss of parts.

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