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Infrared detection module, preparation method thereof and electronic equipment

An infrared detection and module technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of large volume and low integration, and achieve the effects of efficient interconnection, miniaturization, and three-dimensional volume reduction.

Active Publication Date: 2021-03-12
QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing infrared detection modules generally have the defects of low integration and large volume

Method used

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  • Infrared detection module, preparation method thereof and electronic equipment
  • Infrared detection module, preparation method thereof and electronic equipment
  • Infrared detection module, preparation method thereof and electronic equipment

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Embodiment Construction

[0043] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0044] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0045] In addition, in t...

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Abstract

The invention discloses an infrared detection module, a preparation method thereof and electronic equipment. The infrared detection module comprises a substrate, a field programmable logic gate arraychip and an infrared acquisition chip, and the field programmable logic gate array chip is arranged on the substrate in a stacked manner and is electrically conducted with the substrate; the infraredacquisition chip is arranged on the field programmable logic gate array chip in a stacked manner, and is electrically connected with the field programmable logic gate array chip through a silicon through hole in the field programmable logic gate array chip and a conductive column in the silicon through hole. According to the technical scheme, miniaturization and high integration of the infrared detection module can be realized.

Description

technical field [0001] The invention relates to the field of packaging technology, in particular to an infrared detection module, a preparation method thereof, and electronic equipment using the infrared detection module. Background technique [0002] In the fields of security, intelligent building control, and the Internet of Things, infrared detection modules have been widely used. However, the existing infrared detection modules generally have the defects of low integration and large volume. Now that miniaturization and high integration have become the mainstream design ideas, how to realize the miniaturization and high integration of infrared detection modules has always been a hot research topic for developers. Contents of the invention [0003] The main purpose of the present invention is to provide an infrared detection module and its preparation method, aiming at realizing the miniaturization and high integration of the infrared detection module. [0004] In orde...

Claims

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Application Information

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IPC IPC(8): H01L25/16H01L23/48H01L21/50G01D5/26G01D5/12
CPCH01L25/167H01L23/481H01L21/50G01D5/26G01D5/12
Inventor 徐健王伟
Owner QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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