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Optical interconnection method of optoelectronic integrated devices

A technology of integrated devices and optical interconnection, applied in optical components, optical waveguide coupling, instruments, etc., can solve the problems of long time and large loss, and achieve the effect of low optical loss

Active Publication Date: 2022-04-22
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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Problems solved by technology

The long time and large loss caused by the previously used lens coupling method can be solved by the new photon lead

Method used

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  • Optical interconnection method of optoelectronic integrated devices
  • Optical interconnection method of optoelectronic integrated devices

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Embodiment Construction

[0028] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0029] In order to solve the technical problems of long time and large loss in the prior art, the present invention proposes an optical interconnection method for optoelectronic integrated devices, which directly passes the laser and the modulator, the laser and the polarization-maintaining fiber, and the modulator and the polarization-maintaining fiber. The photonic lead is connected to minimize the process flow. At the same time, the connection between the chips and the polarization-sensitive devices between the chip and the polarization-maintaining fiber can greatly reduce the optical coupling loss, realize the mode matching between the chips, and help realize large-scale photonic integration. .

[0030] By using the l...

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Abstract

The invention provides an optical interconnection method of an optoelectronic integrated device, comprising: making a photon lead; wherein, the photon lead includes a core, a stress region and an inner cladding; connecting a laser and an optical modulator through the photon lead, The laser and the polarization-maintaining optical fiber, the optical modulator and the polarization-maintaining optical fiber are connected through the photonic lead, and a polarization-maintaining optical channel is established to realize optical interconnection. The invention directly realizes the polarization interconnection of optoelectronic devices in the chip, such as lasers, modulators, polarization-maintaining optical fibers, etc., through the photon lead printing method. The UV-curable adhesive material used has low optical loss and can be efficiently interconnected between optoelectronic devices. To achieve mode field matching, aiming at the mismatch of mode spots of different optoelectronic devices, the mode field matching is realized through the photon lead structure.

Description

technical field [0001] The invention relates to the fields of optical fiber communication, optoelectronic devices, integrated optoelectronic packaging and the like, in particular to an optical interconnection method of optoelectronic integrated devices. Background technique [0002] With the increasing prosperity of mobile Internet, cloud computing, and big data, emerging applications such as 5G communication continue to emerge, and high-speed optical communication and optical fiber sensor devices based on optical fiber communication continue to develop. Integrated optoelectronics has become the only way for information transmission, and the packaging structure of integrated chips and optical coupling loss have become important research issues. The development and production of small-scale integrated optoelectronic devices has become an important research content, and the use of hybrid integrated chips to overcome the "speed bottleneck" of electrical chips has become a mains...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/42
CPCG02B6/4296G02B6/4216
Inventor 王欣翟鲲鹏孙文惠李明祝宁华
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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