Liquid cooling heat dissipation device of headset and headset with high heat dissipation

A headphone, liquid cooling technology, applied in on-ear/around-ear headphones, earpiece/headphone accessories, sensor parts, etc. Affected by external interference, the heat from the human ear cannot be discharged in time, etc., to achieve the effect of alleviating the fever, realizing circulating heat dissipation, and having a compact and simple device structure

Active Publication Date: 2021-03-12
AVIC HUADONG OPTOELECTRONICS (SHANGHAI) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] There are two main reasons for ear heating when wearing headphones. One is that after the earmuffs cover the ears for a long time, the heat emitted by the human ear itself cannot be discharged in time; The conversion efficiency of "electricity → sound" is only about 5%, and most of the energy is turned into heat radiation in the earmuff space
[0004] At present, the heat dissipation of headphones is basically improved by measures such as highly breathable earmuffs, sponges and hollow earmuffs. However, these measures are based on strengthening the air convection inside and outside the earmuffs. The passive noise isolation ability of the earphones makes the user vulnerable to external interference

Method used

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  • Liquid cooling heat dissipation device of headset and headset with high heat dissipation
  • Liquid cooling heat dissipation device of headset and headset with high heat dissipation
  • Liquid cooling heat dissipation device of headset and headset with high heat dissipation

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Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] In the following description, many specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, therefore, the protection scope of the present invention is not limited by the specific implementation disclosed below. Example limitations.

[0035] In describing the present invention, it should be understood that the terms "center", "l...

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Abstract

The invention discloses a liquid-cooling heat dissipation device of a headset and the headset with high heat dissipation. The liquid-cooling heat dissipation device comprises a shell and a heat-conducting medium arranged in the shell, the shell is in an inverted J shape, a flowing cavity used for containing a heat conduction medium is formed in the shell in the length direction of the shell, the flowing cavity comprises a first vertical part and a first bent part which are matched with the shell in shape, the first vertical part is used for being tightly attached to the heating face of the loudspeaker magnetic cover, and the first vertical part is perpendicular to the horizontal plane when the earphone is worn. At least part of the first bent parts are used for penetrating through the earmuffs to extend outwards. And the heat-conducting medium is arranged in the flowing cavity and can form circulating flow in the flowing cavity through temperature change. The headset is compact and simple in structure, the headset is provided with an inner-outer circulating heat dissipation system, heat generated by the loudspeaker unit during working is conducted to the outside of the earmuffs, and the heating condition of the headset during wearing is relieved to a certain extent.

Description

technical field [0001] The invention relates to the technical field of earphone heat dissipation, in particular to a liquid-cooled heat dissipation device for a headset and a high-radiation headset. Background technique [0002] In current people's work and life, headphones are widely used and have become an indispensable acoustic device. People who often wear headphones encounter the biggest problem is the comfort of using headphones, especially the ear heat and sweating caused by long-term wearing. [0003] There are two main reasons for ear heating when wearing headphones. One is that after the earmuffs cover the ears for a long time, the heat emitted by the human ear itself cannot be discharged in time; The conversion efficiency of "electricity → sound" is only about 5%, and most of the energy is turned into heat radiation in the earmuff space. [0004] At present, the heat dissipation of headphones is basically improved by measures such as highly breathable earmuffs, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/10
CPCH04R1/1091H04R1/1008H04R2201/10
Inventor 曹振雷马翼平黄盈宇
Owner AVIC HUADONG OPTOELECTRONICS (SHANGHAI) CO LTD
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