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Chopped quartz fiber reinforced silica ceramic paste for photocuring and preparation method thereof

A technology of quartz fiber and silicon oxide, applied in the direction of additive processing, etc., to improve the absorption rate, improve the printing accuracy, and improve the strength.

Active Publication Date: 2021-11-30
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, many universities and scientific research institutions are researching the photocuring molding technology of silica ceramics, but there are few reports on the research on silica fiber reinforced silica ceramic paste. Therefore, how to realize the preparation and processing of silica fiber reinforced silica ceramic paste SLA molding is of great significance to the development of high performance radomes / windows

Method used

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  • Chopped quartz fiber reinforced silica ceramic paste for photocuring and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Embodiment 1, a kind of chopped quartz fiber reinforced silica ceramic paste for photocuring, its component includes spherical SiO 2 Powder, density 2.2g / ml; content SiO 2 Powder 10wt% bundle-shaped chopped quartz fibers with a density of 2.2g / ml; content of SiO 2 Powder 1wt% powder dispersant; with SiO 2 A resin mixture with a volume ratio of powder and quartz fiber of 37.0:63.0, a density of 1.09g / ml; a photoinitiator with a content of 1.75wt% of the resin mixture; a silane coupling agent with a content of 1.5wt% of the resin mixture ; The content is 5‰ light absorbing agent of the resin mixture;

[0028] The SiO 2 The powder is a mixture of particle size d50=1~2um and d50=200nm according to the mass fraction of 7:3;

[0029] Described powder dispersant is stearic acid;

[0030] The light absorbing agent is light absorbing agent N30;

[0031] The resin mixed solution is a mixture of monomer hexahydrophthalic acid diglycidyl ether, 1,6 hexanediol diacrylate (HDDA...

Embodiment 2

[0041] Embodiment 2, a kind of chopped quartz fiber reinforced silicon oxide ceramic paste for photocuring, its component includes spherical SiO 2 Powder, density 2.2g / ml; content SiO 2 Powder 5wt% bundle-shaped chopped quartz fibers with a density of 2.2g / ml; content of SiO 2 Powder 1.5wt% powder dispersant; with SiO 2 A resin mixture with a volume ratio of powder and quartz fiber mixture of 40.7:59.3 and a density of 1.09 g / ml; a photoinitiator with a content of 1.75 wt% of the resin mixture; a silane coupling agent with a content of 1 wt% of the resin mixture; The content is 1‰ of the light absorbing agent in the resin mixture;

[0042] The SiO 2 The powder is a mixture of particle size d50=1~2um and d50=200nm according to the mass fraction of 7:3;

[0043] Described powder dispersant is stearic acid;

[0044] The light absorbing agent is light absorbing agent N30;

[0045] The resin mixed solution is a mixture of monomer hexahydrophthalic acid diglycidyl ether, 1,6 h...

Embodiment 3

[0055] Embodiment 3, a kind of chopped quartz fiber reinforced silicon oxide ceramic paste for photocuring, its component includes spherical SiO 2 Powder, density 2.2g / ml; content SiO 2 Powder 7wt% bundle-shaped chopped quartz fibers with a density of 2.2g / ml; content of SiO 2 Powder 1.2wt% powder dispersant; with SiO 2 A resin mixture with a volume ratio of powder and quartz fiber of 38.1:61.9 and a density of 1.09g / ml; a photoinitiator with a content of 1.75wt% of the resin mixture; a silane coupling agent with a content of 1.3wt% of the resin mixture ; The content is 2.1‰ light absorbing agent in the resin mixture;

[0056] The SiO 2 The powder is a mixture of particle size d50=1~2um and d50=200nm according to the mass fraction of 7:3;

[0057] Described powder dispersant is stearic acid;

[0058] The light absorbing agent is light absorbing agent N30;

[0059] The resin mixed solution is a mixture of monomer hexahydrophthalic acid diglycidyl ether, 1,6 hexanediol dia...

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Abstract

A kind of chopped quartz fiber reinforced silicon oxide ceramic paste for photocuring and its preparation method, first make bundle-shaped chopped quartz fiber into monofilament chopped quartz fiber; then SiO 2 The powder is mixed with the powder dispersant, and ball milled by a ball mill, sieved, and dried to obtain a solid mixture; then the photoinitiator and silane coupling agent are added to the resin mixture, and the photocurable resin system is obtained by ball milling, and the photocurable resin system Add it to the solid mixture, drop the light absorbing agent at the same time, stir it into a flocculent form, then put it into a homogeneous mixer for mixing and vacuumize to obtain a silica ceramic paste; finally add the monofilament chopped quartz fiber to the Silica ceramic paste, put it in a homogeneous mixer and mix well to get chopped quartz fiber reinforced silica ceramic paste for light curing; the obtained paste has high printing accuracy, high solid content, and fiber dispersion Uniformity and other characteristics.

Description

technical field [0001] The invention belongs to the technical field of additive manufacturing of silicon oxide ceramics, and in particular relates to a chopped quartz fiber reinforced silicon oxide ceramic paste for photocuring and a preparation method thereof. Background technique [0002] Additive manufacturing technology has been developed for more than 30 years. Its molding technology includes fused deposition modeling technology, laser sintering / cladding technology and stereolithography (SLA) technology. It has fast molding speed, high precision, and can quickly complete complex parts. A series of advantages such as manufacturing. Photocuring molding refers to the use of liquid photosensitive resin as raw material, and the ultraviolet light source scans the cured resin layer by layer according to a certain scanning path until the printing is completed; its printing accuracy is high and the technology is mature. It is a well-developed and promising additive material at p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B26/06B33Y70/10C04B14/46
CPCB33Y70/10C04B26/06C04B2111/00181C04B14/062C04B14/4631C04B24/085C04B24/005C04B24/023C04B24/42C04B2103/0068C04B24/003
Inventor 鲍崇高董文彩李世佳
Owner XI AN JIAOTONG UNIV
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