Long-service-life electronic component chip preparation platform

Abstract

The invention discloses a long-service-life electronic component chip preparation platform, and particularly relates to the technical field of electronic components, the long-service-life electronic component chip preparation platform comprises a preparation platform, the upper surface of the preparation platform is fixedly connected with a mechanical arm, the left side surface of the mechanical arm is provided with a mechanical claw end, the left end of the mechanical claw end is provided with a clamping mechanism, and a micro air pump is arranged on the upper surface of the mechanical claw end. Gas is conducted to the square air bag through the micro air pump by means of the flow dividing mechanism and the second flow dividing channel, the square air bag expands to clamp an electronic chip to prevent the electronic chip from loosening, and when the pressure in the square air bag is large, the piston stop block contracts under large pressure, so that the gas is conveniently divided and guided into the heating mechanism to be exhausted, and corrosive liquid can be conveniently and quickly dried; and compared with a traditional preparation platform, the preparation platform has theadvantages that the chip can be quickly positioned and prevented from deviating, the corrosive liquid can be quickly dried and cleaned, and the service life of the preparation platform is guaranteed.

Description

technical field [0001] The invention relates to the technical field of electronic components, and more specifically, the invention relates to a preparation platform for electronic component chips with long service life. Background technique [0002] Chinese patent document CN202010391267.3 discloses a semiconductor chip preparation device, which records "including: a semiconductor transfer device, the semiconductor transfer device includes a mechanical arm and a vacuum adsorption device, and the mechanical arm is provided with adsorption holes , the adsorption hole is connected with the vacuum adsorption device for adsorption of semiconductor chips; gas cleaning device, the gas cleaning device is used to spray cleaning gas to the mechanical arm to clean the mechanical arm. The semiconductor chip preparation device of the embodiment of the present invention can not only reduce the corrosion damage of the corrosive gas to the mechanical arm, but also reduce the pollution of th...

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Problems solved by technology

[0003] In order to overcome the above-mentioned defects of the prior art, the present invention provides an electronic component chip preparation platform with high service life. The technical problem to be solved by the present invention is: although the existing preparation platform can clean its corrosive gas, However, when cleaning the corrosive gas, the ejected gas is likely to cause displacement of the chip, which is not convenient for stable clamping. At the same time, it only cleans the corrosive gas, and the small amount of corrosive liquid formed is not easy to clean. The problem that corrosive liquids are easy to cause corrosion and affect the service life of the preparation platform

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