Rapid computer heat dissipation device based on magnetic attraction principle

A heat dissipation device and computer technology, applied to components, calculations, and mechanical equipment of pumping devices for elastic fluids, can solve problems such as poor dustproof effect, low heat dissipation efficiency, and environmental protection, and achieve improved heat dissipation efficiency, Avoid the effects of heat and speed reduction

Inactive Publication Date: 2021-03-23
广州智索信息科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a fast heat dissipation device for computers based on the principle of magnetic attraction, which has the advantages of quietness, dust prevention, good heat dissipation effect, energy saving and environmental protection, and solves the problem of poor dustproof effect of traditional computer heat dissipation devices. , low heat dissipation efficiency, and environmental problems

Method used

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  • Rapid computer heat dissipation device based on magnetic attraction principle
  • Rapid computer heat dissipation device based on magnetic attraction principle
  • Rapid computer heat dissipation device based on magnetic attraction principle

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] see Figure 1-8 , a fast cooling device for computers based on the principle of magnetic attraction, comprising a frame 1, a windshield film 3 is movably connected between the back side of the frame 1 and the movable plate 2, and a cooling hole 4 is opened inside the frame 1, The inner wall of the heat dissipation hole 4 is movably connected with a movable plate 2, the connection mode of the movable plate 2 and the heat dissipation hole 4 is a sliding c...

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Abstract

The invention relates to the technical field of computer heat dissipation, and discloses a rapid computer heat dissipation device based on a magnetic attraction principle, which comprises a rack, heatdissipation holes are formed in the rack, movable plates are movably connected to the inner walls of the heat dissipation holes, and reset springs are fixedly connected to the inner walls of the movable plates. Sliding magnetic blocks are fixedly connected to the opposite ends of the reset springs, rotating magnetic discs are arranged at the opposite ends of the sliding magnetic blocks, and an air bag is movably connected into the movable plate. According to the rapid computer heat dissipation device based on the magnetic attraction principle, inward attraction force is given to the sliding magnetic block through the fixed magnetic block, the sliding magnetic block overcomes resistance of the reset spring and moves in the opposite direction along the inner wall of the movable plate, the pressure intensity of the opposite sides of the sliding magnetic block is reduced, hot air in a case is pumped out, and heat dissipation holes with the increased opening degree are matched; rapid convection of air inside and outside the case is achieved, and the heat dissipation efficiency of the case is improved.

Description

technical field [0001] The invention relates to the technical field of computer cooling, in particular to a fast cooling device for computers based on the principle of magnetic attraction. Background technique [0002] In order to achieve numerical and logical calculations, run according to the program, and automatically and high-speed process massive data, a large number of integrated circuits are installed in the computer components. As we all know, high temperature is the enemy of integrated circuits. High temperature will not only lead to unstable operation of the system, but also It will burn some electronic components and greatly shorten the service life of the computer. [0003] The traditional heat dissipation device has the following problems: 1. The opening of the heat dissipation hole is fixed. When the computer is not in use, dust will enter the inside of the chassis and cover the electronic components, affecting the contact between the electronic components and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20B08B17/04F04D29/66
CPCB08B17/04F04D29/668G06F1/20
Inventor 沈严
Owner 广州智索信息科技有限公司
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