31results about How to "Enough cooling area" patented technology

The invention discloses a reflection type LED (Light-Emitting Diode) high beam for a vehicle. The high beam comprises a reflector cup, an LED mounting column, a reflector cup bracket and a radiating shell; the inner surface of the reflector cup is a regular curve; the cross section of the LED mounting column is a polygon; the LED mounting column is arranged at the inner side of the regular curve and pointed to the focus of the regular curve; an LED chip is arranged on at least one surface of the LED mounting column and located in the focus of the regular curve; and the reflector cup bracket is arranged between the reflector cup and the radiating shell and used for supporting the reflector cup.

The invention discloses a reinforcement construction method and particularly relates to a construction method for reinforcing a large rock slope deep weak structural plane. The construction method comprises the following steps: A, excavating a main tunnel along the direction of the deep weak structural plane of a rock slope, performing temporary support, and then drilling drainage holes on a tunnel soffit; B, excavating branch tunnels from two side walls of the main tunnel to the top wall and bottom wall directions of the deep weak structural plane, performing temporary support and then drilling drainage holes on tunnel soffits; and C, backfilling concretes into the main tunnel and the branch tunnels, and arranging steel bars to reinforce the backfilled concrete, wherein concrete backfilling is at least divided into two following construction period: in the first construction period, the backfilled concretes are backfilled along the peripheral inner walls of the main tunnel and the branch tunnels in a covering way, backfilling layers of the first construction period are formed on the walls of the main tunnel and the branch tunnels after the first construction period of concrete backfilling is finished, and the residual spaces of the main tunnel and the branch tunnels are utilized as grouting galleries; and after the backfilled concretes of the first construction period are solidified, the backfilled concretes of the residual construction period are utilized to fill the whole grouting galleries.

The invention provides a heat-conducting bonding pad and a package structure of a QFP chip with the heat-conducting bonding pad. The heat-conducting bonding pad comprises a bonding pad region and a peripheral region, wherein the bonding pad region is provided with a plurality of bonding pad parts which are arranged in an array; and gaps are formed among the bonding pad parts. The bonding pad parts of the heat-conducting bonding pad are arranged in the array and are isolated from one another, and the area of the bonding pad parts is greatly reduced, so that, on one hand, the escape path of a gas generated by soldering flux pyrolysis in a solder paste in a high-temperature welding process is shortened; and on the other hand, the gaps between the adjacent bonding pad parts provide channels for escape of the gas; the gas can timely escape; the area and the quantity of bubbles are effectively reduced; the condition that the chip has enough heat radiating area is ensured; and the heat radiating effect is improved. Meanwhile, the effective area of a conductor formed by the bonding pad is increased, so that the grounding impedance of the chip is reduced; and the reliability of the chip is improved. The welding effect of the heat-conducting bonding pad is improved; and excessive floating of the chip is avoided, so that the welding reliability of peripheral pins is improved.

The invention relates to the technical field of vacuum metallurgical equipment, in particular to an electro-magnetic induction internal thermal type metallic magnesium vacuum reduction furnace which comprises a furnace body. A material basket (8) is arranged in the furnace body, and a central channel penetrating through the bottom face of the material basket (8) is formed in the center of the material basket (8). One or more heating cylinders (7) are concentrically arranged in the material basket (8). The material basket (8) and the heating cylinders (7) are filled with furnace burdens (9). A rectangular iron core is arranged in the furnace body. One long edge of the rectangular iron core penetrates through the central channel of the material basket (8), and a primary side coil (12) is wound around the other long edge of the rectangular iron core. The leading-out end of a copper winding of the primary side coil (12) is led out of the furnace through an insulated sealing device on the furnace body and is connected with a power source device. The electro-magnetic induction internal thermal type metallic magnesium vacuum reduction furnace is reasonable in design, distribution of a temperature field of the reduction furnace can be regulated, and heat transfer efficiency is high; the vacuum reduction furnace is used for high-vapor-pressure metallothermics production of magnesium, lithium, strontium, calcium and the like.

The present invention relates to a virtual instrument platform. The platform comprises a housing, a board card and a mainboard, wherein the mainboard and the board card can be detachably connected to each other, both the board card and the main board are located out of the housing, a board card interface hole is pre-arranged on the surface of the housing, and a board card interface that connects the board card with an external device is exposed outside by means of the board card interface hole. The virtual instrument platform further comprises a touch display screen, wherein the touch display screen is mounted on the housing and forms a panel structure together with the housing. In the implementation mode of the present invention, the housing further comprises a body and a side cover, wherein the side cover and the body can be detachably connected with each other and the side cover is located on one side of the board card. Compared with the prior art, the virtual instrument platform provided by the present invention has an in-built board card, has relatively high mobility and stability and has a better weak three-proofing ability, without being limited by the application environment and the scenarios.

The invention discloses an LED lamp heat dissipation structure and an LED energy-saving lamp with the same. A first heat dissipation component is an outer side heat dissipation component of the LED lamp heat dissipation structure, and a second heat dissipation component is an inner side heat dissipation component of the LED lamp heat dissipation structure; a plurality of protruding second heat dissipation fins are distributed on the outer side face of the second heat dissipation component in a connected mode, the first heat dissipation component is arranged on the outer side of the second heat dissipation component in a connected mode, a plurality of protruding first heat dissipation fins are distributed on the inner side face and the outer side face of the body of the first heat dissipation component in a connected mode, and heat dissipation height separation space where heat generated when an LED chip works is rapidly conducted to the second heat dissipation component and radiated in convective air is reserved between the bottom end of the inverted first heat dissipation component and the outer side of the second heat dissipation component. The LED lamp heat dissipation structure has sufficient heat dissipation areas, has more heat dissipation areas than a conventional heat dissipation aluminum piece, has more convective air mass flow, can rapidly produce cross ventilation of an inner cavity and an outer cavity of the heat dissipation aluminum piece, and reaches the effect that the heat is rapidly scattered.

The invention relates to the field of manufacturing technologies for products such as heat radiators, and discloses an embedment technology of a section extruding structure and a pressure casting structure of dense blades. The technology comprises the following steps that firstly, a section extruding piece is manufactured; secondly, a pressure casting face is machined; thirdly, a pressure casting mold is designed; fourthly, the pressure casting mold is manufactured; and fifthly, in-mold pressure casting is carried out. The work efficiency of products manufactured through the technology is high, production in an assembly line scale manner can be achieved, and the machining amount is small, so that the embedment technology is completed, the reject ratio of the products is low, and meanwhile the production cost is reduced. Meanwhile, later CNC machining procedures can be reduced, high stability is achieved after the products are directly embedded, the overall structural strength is higher, and the service life of the products is longer. The products manufactured through the embedment technology are good in attachment performance and sealing performance, the section extruding structure and the pressure casting structure are perfectly embedded, good heat conduction capacity is achieved after embedment, the enough heat radiation area is achieved, and therefore the products overall have good heat radiation performance.

The invention discloses a novel process for processing sections of a finned radiator, and relates to the technical field of radiator section processing, which aims to solve the technical problems of poor physical properties, poor mechanical properties and short service life of existing sections of the finned radiator. The novel process comprises the following steps of (1) treating aluminum blocksas raw materials so as to obtain aluminum alloy sections; (2) performing preliminary extrusion forming on a cooling plate on the aluminum alloy sections; (3) straightening and aging a workpiece whichis extruded in the previous step; (4) performing secondary extrusion forming on the cooling plate on the aluminum alloy sections; (5) straightening and aging the workpiece which is extruded in the previous step; (6) preparing before assembly; and (7) assembling, performing surface treatment, spraying, inspecting, packaging and warehousing. The novel process has the advantages of good mechanical properties, high production efficiency, low cost and long service life.

The invention relates to a single-spiral embedded excitation type magnesium vacuum reduction furnace adopting electromagnetic induction inner heating. The magnesium vacuum reduction furnace comprisesa furnace body, wherein a plurality of cylindrical baskets are arranged in the furnace body in a honeycomb shape, a single excitation coil is embedded in the wall of each basket body, is introduced from the bottom of the wall of the basket body, rises spirally, and is led out from the top; the excitation coils of the plurality of baskets are connected in series, and then led outside the furnace body by an insulating sealing device on the furnace body to be connected with a power device; electric energy is transmitted to the baskets in a contactless manner to heat reaction furnace charge; the whole heating body is uniformly heated and cannot be damaged by local high temperature. The problems of severe excitation coil loss, high inductance leakage and high cost of required reactive power compensation capacitance of existing electric internal heating type vacuum reduction furnaces are solved. The vacuum reduction furnace is reasonable in design, distribution of the temperature field of the reduction furnace can be adjusted, and heat transfer efficiency is high. The vacuum reduction furnace is mainly used for high vapor pressure production of metals such as magnesium, lithium, strontium, calcium and the like with a thermal reduction method.

The invention discloses an LED lamp body type heat pipe radiating system comprising a lamp body in which a hollow cavity is arranged, an opening of the inner cavity of the lamp body is provided with a sealing glass plate, a fixing mechanism is arranged in the inner cavity of the lamp body, a liquid medium storing cavity for storing a radiating medium is formed between the sealing glass plate and the fixing mechanism, and an LED optical system is arranged in the liquid medium storing cavity, is connected to the surface of the fixing mechanism and faces the sealing glass plate; and a liquid filling hole is arranged at one side of the lamp body and is communicated with the liquid medium storing cavity. A body type heat pipe can be made into any sizes so as to arrange enough radiation area for a lamp; radiating fins of the body type heat pipe can be vertically arranged to avoid dust retention, and rainwater can ensure the cleanness of the radiating fins; the vertically arranged radiating fins have the radiation effect of strengthening natural convection; and the body type heat pipe has the function of rapidly equalizing the temperature of a bottom plate through fluid convection heat transfer.

The invention belongs to the field of electrical technology, in particular to a stainless steel piecewise adjustable resistor and an adjustable brake resistor. The adjustable resistor comprises a resistor body formed by welding a plurality of sub resistors end to end and U-shaped insulators. The head end of the sub resistor on one side and the tail end of the sub resistor on the other side form aresistor input end and a resistor output end respectively. Shorting copper bars are arranged on the resistor body. The U-shaped insulators are fixedly arranged between the stainless steel strips of the sub resistors. Through different lapping modes of the shorting copper bars, the resistor can output different resistances. The piecewise adjustable resistor is put into water to form a break resistor, and the resistance of the piecewise adjustable resistor and water determine the resistance of the brake resistor together. The piecewise adjustable resistor is in full contact with water. With theincrease of water temperature, the water absorbs a large amount of heat converted from electric energy. Thus, the safety of the piecewise adjustable resistor under very high current density is ensured, and fast speed reduction of a high-power and large-capacity motor is realized. The formed brake resistor has the advantages of high power, high current, resistance to high voltage and high energy absorption.

The invention discloses a digital light processing machine, which is characterized in that a light modulation module and a second light path module are stacked at the upper end of a first light path module, so that in a three-dimensional coordinate system taking a connecting point of the light modulation module and the first light path module as an origin of coordinates, the light path propagation direction reaches a projection lens in the negative direction of an X axis, the positive direction of a Z axis and the positive direction of the X axis in sequence; the projection area on the XOZ plane is larger than the projection area of the digital light processing machine on the XOY plane; supporting legs extending in the negative direction of the Z axis are arranged on the side wall of the first light path module and used for supporting the first light path module, so that an interval space exists between the lower cover plate and the end face of the workbench; and the interval space accommodates a plurality of wiring terminals connected with an optical device in the first optical path module, and provides a heat conduction channel for the plurality of heat conduction holes. The overall heat dissipation effect of the digital optical processing machine is improved, and the overall occupied area of the digital optical processing machine is also reduced.

The invention discloses a multi-path high-performance server capable of improving heat dissipation performance and a heat dissipation method thereof, and belongs to the technical field of server heatdissipation. According to the multi-path high-performance server for improving the heat dissipation performance, a case is designed into an upper layer and a lower layer, a complete machine fan and aCPU radiator are arranged on the upper layer of the case, the whole machine fan is arranged at the rear end of the case, the CPU radiator is arranged at the front end of the case, the CPU radiator comprises a CPU radiator fin and a CPU cooling fan, the CPU cooling fan is connected to the CPU radiator fin, and the CPU cooling fan is arranged on the front side of the CPU cooling fin; and a power module, a hard disk storage module and a panel cooling fan are arranged on the lower layer of the case, the hard disk storage module is arranged at the front end of the case, the power supply module is arranged at the rear part of the case, and the panel cooling fan is arranged at the rear end of the case. According to the multi-path high-performance server for improving the heat dissipation performance, the heat dissipation can be enhanced, so that the reliability of server products is improved, and the popularization and application values are good.