Virtual Instrument Platform

A virtual instrument and platform technology, applied in the field of virtual instrument platform, can solve the problems of virtual instrument mobility, poor drop resistance, waterproof and dustproof ability, lack of portability and low stability of the system, so as to improve portability, The effect of maintaining integrity and improving mobility

Inactive Publication Date: 2018-09-28
广州岱诺智能系统有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It makes its accessories complex, with many connections, the system is not portable, and the stability is low
And because the components need to be connected by cables, the mobility, drop resistance, waterproof and dustproof capabilities of the existing virtual instrument are relatively poor

Method used

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Embodiment Construction

[0019] In order to make the objectives, technical solutions, and advantages of the present invention clearer, the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, a person of ordinary skill in the art can understand that, in each embodiment of the present invention, many technical details are proposed for the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solutions claimed by the claims of this application can be realized.

[0020] The first embodiment of the present invention relates to a virtual instrument platform, such as figure 1 with figure 2 As shown in combination, it includes a housing 1, a board 2 and a main board 8. Among them, the main board 8 and the board 2 are detachably connected, the board 2 and the main board 8 are both located in the housin...

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Abstract

The present invention relates to a virtual instrument platform. The platform comprises a housing, a board card and a mainboard, wherein the mainboard and the board card can be detachably connected to each other, both the board card and the main board are located out of the housing, a board card interface hole is pre-arranged on the surface of the housing, and a board card interface that connects the board card with an external device is exposed outside by means of the board card interface hole. The virtual instrument platform further comprises a touch display screen, wherein the touch display screen is mounted on the housing and forms a panel structure together with the housing. In the implementation mode of the present invention, the housing further comprises a body and a side cover, wherein the side cover and the body can be detachably connected with each other and the side cover is located on one side of the board card. Compared with the prior art, the virtual instrument platform provided by the present invention has an in-built board card, has relatively high mobility and stability and has a better weak three-proofing ability, without being limited by the application environment and the scenarios.

Description

Technical field [0001] The invention relates to an electronic device, specifically a virtual instrument platform. Background technique [0002] Virtual instrument technology is the use of high-performance modular hardware, combined with efficient and flexible computer software to complete various testing, measurement and automation applications. The advantage of virtual instrument technology is to provide users with an instrument solution that is more flexible than dedicated instruments, can be customized, performance can be improved with computer software and hardware, and at a more favorable price. Virtual instrument technology uses boards with multiple functions. These boards and computers form a virtual instrument platform. In aerospace, navigation, electric power, automation and other industries, it is widely used in data acquisition, testing, measurement and other fields. [0003] The existing virtual instrument platform usually uses a large computer case and installs the bo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/16
Inventor 李明东青建德刘军
Owner 广州岱诺智能系统有限公司
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