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Manufacturing method of LED lamp body with heat dissipating structure and LED lamp body

A technology of LED lamp body and heat dissipation structure, applied in the electrical field, can solve the problems of poor heat conduction effect of PCB board and high cost of PCB board, and achieve the effect of simple structure, simple method and good heat conduction effect

Inactive Publication Date: 2010-01-06
刘昌贵
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, there are the following problems in dissipating heat from LEDs through the PCB board: since the PCB board usually has an insulating base material, the heat conduction effect of the PCB board is not good, and the cost of using the PCB board for heat dissipation is too high

Method used

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  • Manufacturing method of LED lamp body with heat dissipating structure and LED lamp body
  • Manufacturing method of LED lamp body with heat dissipating structure and LED lamp body
  • Manufacturing method of LED lamp body with heat dissipating structure and LED lamp body

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Embodiment Construction

[0054] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0055] figure 1 It is a schematic diagram of the structural composition of the first embodiment of the LED lamp body with heat dissipation structure of the present invention; figure 1 As shown, the LED lamp body of this embodiment at least includes: a metal plate body 1 for heat dissipation, distributed in the gaps on the metal plate body 1 at intervals, and used as the first connection of the connecting wire between the LED light sources body 2, and a plurality o...

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Abstract

The embodiment of the invention discloses a manufacturing method of an LED lamp body with a heat dissipating structure and the LED lamp body, wherein the LED lamp body comprises a plurality of LED light sources, a plurality of first connecting bodies and a metal plate body, wherein the first connecting bodies are distributed at intervals and used as connecting lines among the LED light sources; the metal plate bodies are used for dissipating heat; the first connecting bodies are distributed in gaps on the metal plate body at intervals; and the LED light sources are electrically connected among the first connecting bodies through respective electrodes and connected with the metal plate body through respectively heat conducting base plate. The embodiment of the invention forms the LED lamp body with heat dissipating structure by processing a metal plate and has simple mode; and in addition, the formed heat dissipating structure has no insulating base material, thereby having good heat conducting effect.

Description

technical field [0001] The invention relates to the field of electricity, in particular to a method for manufacturing an LED lamp body with a heat dissipation structure and the LED lamp body. Background technique [0002] Light Emitting Diodes (LEDs) are widely used in the field of lighting. When the power and brightness of LEDs increase, improving the heat dissipation structure of LED light sources is of great significance for improving the use efficiency of LEDs and prolonging the life of LEDs. At present, the way to dissipate heat for LEDs is usually to solder (or fix) the LEDs on a printed circuit board (Printed Circuit Board, PCB) board, to dissipate heat from the LEDs through the metal part on the PCB, or to dissipate heat through the PCB. The board transfers the heat of the LEDs to the external luminaires, which dissipate heat from the external luminaires. [0003] However, there are the following problems in dissipating heat from LEDs through the PCB board: since th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V23/00F21V23/06F21V29/00F21Y101/02F21K9/20F21Y115/10
Inventor 刘昌贵
Owner 刘昌贵
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