A method for fabricating an integrated device, a light-emitting unit, and a display panel are disclosed. The method involves: first, setting up connection circuits for light-emitting components and functional components; then, bonding the connection circuits of the light-emitting components and the functional components to a target substrate; finally, encapsulating the light-emitting components, the functional components, and the target substrate to form an integrated device. By combining the light-emitting components and functional components, the
utilization rate of the target substrate can be improved, achieving both
light emission and the functionality of the functional components.