Semiconductor device
A technology for semiconductors and conductive parts, which is applied in the fields of semiconductor devices, semiconductor/solid-state device components, and electric solid-state devices, etc., and can solve problems such as the degradation of the quality of semiconductor devices
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no. 1 approach
[0015] Refer below Figure 1 to Figure 6 The first embodiment will be described. In this specification, components according to the embodiments and descriptions of these components can be described by various expressions. These components and their descriptions are exemplary and not limited by the expressions of this specification. Components may be identified by different nomenclature from those in this specification. These components may be described by expressions different from the expressions in this specification.
[0016] figure 1 is an exemplary perspective view of the semiconductor device 1 of the first embodiment. The semiconductor device 1 is, for example, a power device. The semiconductor device 1 is not limited to this example, and may be another device.
[0017] As shown in the drawings, in this specification, an X-axis, a Y-axis, and a Z-axis are defined for convenience. The X-axis, Y-axis and Z-axis are orthogonal to each other. The X-axis is set along ...
no. 2 approach
[0099] Refer below Figure 7 to Figure 9 The second embodiment will be described. In the description of the following embodiments, components having functions similar to those of components already described are denoted by the same reference numerals as components already described, and descriptions thereof may be omitted. A plurality of components denoted by the same symbol are not necessarily common for all functions and characteristics, and may have different functions and characteristics according to various embodiments.
[0100] Figure 7 is an exemplary schematic perspective view of a part of the second lead frame 12 and the first connector 14 according to the second embodiment. Figure 8 is a schematic sectional view of a part of the second lead frame 12 and the first connector 14 of the second embodiment. Figure 9 is an exemplary schematic plan view of the second connection surface 45 and the fourth connection surface 65 of the second embodiment.
[0101] like F...
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Abstract
Description
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Application Information
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