Solder paste brushing device for circuit boards
A technology for brushing solder paste and circuit boards, which is applied in the directions of printed circuits, printed circuit manufacturing, and assembly of printed circuits with electrical components, can solve the problems of low replacement efficiency, time-consuming and laborious installation and disassembly of solder paste boards, etc., to improve efficiency, The effect of improving replacement efficiency
Active Publication Date: 2021-03-23
SHENXUN COMP KUNSHAN
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Problems solved by technology
[0004] The object of the present invention is to provide a device for brushing solder paste on circuit boards, which brushes tin evenly and has a simple structure, which effectively solves the problems of time-consuming and laborious installation and disassembly of existing solder paste boards and low replacement efficiency
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[0022] In order to further illustrate the technical means and effects adopted by the present invention, a detailed description will be given below in conjunction with a preferred embodiment of the present invention and its accompanying drawings.
[0023] see Figure 1 to Figure 3 , figure 1 It is a structural schematic diagram of the first embodiment of the circuit board brushing solder paste device of the present invention, figure 2 It is a structural schematic diagram of another viewing angle of the circuit board brushing solder paste device of the present invention in the first embodiment, image 3 is the invention of figure 2 Schematic diagram of the split structure. In this embodiment, the present invention provides a circuit board solder paste brushing device 100, which is used for placing a circuit board 200 and brushing solder paste. The circuit board solder paste brushing device 100 includes:
[0024] The upper carrier board 110 is provided with a plurality of u...
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The invention discloses a solder paste brushing device for circuit boards. The solder paste brushing device comprises an upper carrier plate, a plurality of supporting columns, a lower fixing plate, and locking structures; a plurality of upper fixing holes and a plurality of placing grooves are formed in the upper carrier plate, and the placing grooves are consistent with the circuit boards in shape; the upper ends of the supporting columns are located in the upper fixing holes; a plurality of lower fixing holes are formed in the upper surface of the lower fixing plate, a plurality of groovesare formed in the lower surface of the lower fixing plate, the lower ends of the supporting columns are located in the lower fixing holes, and a plurality of magnetic metal blocks are arranged in thegrooves; and the locking structures are arranged in the plurality of upper fixing holes of the upper carrier plate and the plurality of lower fixing holes of the lower carrier plate. By means of the solder paste brushing device for the circuit boards, a plurality of circuit boards can be placed to be coated with solder paste, and therefore, the solder paste brushing efficiency is greatly improved,the purpose of rapidly and more rapidly loading a carrier plate can be achieved, and the replacement efficiency is greatly improved.
Description
【Technical field】 [0001] The invention relates to the technical field of circuit board printing, in particular to a device for brushing solder paste on a circuit board. 【Background technique】 [0002] At present, brushing solder paste is an important process in the production of circuit board packaging. The traditional process is to place the circuit board on the solder paste board, and then use a scraper to brush the solder paste. In this process, the circuit board is placed manually The board is easy to bump the circuit board, so that the solder paste cannot be brushed to the accurate position of the circuit board, and the solder paste is not evenly brushed with a scraper, and the work efficiency is low. Moreover, due to the different sizes of circuit boards, different solder paste boards are required for replacement. The current replacement method is to disassemble one type of solder paste board and then install another type of solder paste. This replacement method and I...
Claims
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IPC IPC(8): H05K3/34
CPCH05K2203/0165
Inventor 何树强
Owner SHENXUN COMP KUNSHAN