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Substrate processing device

A substrate processing device and substrate technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as poor process, uneven heat transfer on the substrate surface, etc., and achieve the effect of preventing warping and uniform heat transfer

Pending Publication Date: 2021-03-26
SUBARU TECNICA INTERNATIONAL
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0007] The above-mentioned reflow process is performed by applying high-temperature heat to the substrate placed on the platform. When the reflow process is performed, the substrate is thermally expanded due to high-temperature heat transfer to the substrate, and the substrate warpage occurs. Therefore, if the substrate When the substrate cannot be fixed and supported stably due to the warpage phenomenon, the heat transfer on the surface of the substrate becomes uneven, resulting in serious process defects

Method used

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Embodiment Construction

[0053] Hereinafter, the configuration and functions of preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0054] refer to figure 2 and image 3 , the substrate processing apparatus 1 of the present invention includes: a plurality of chambers 100, 200, 300, 400, 500 arranged at predetermined intervals in the circumferential direction for processing substrates; , 200, 300, 400, 500 to transfer the substrate to be able to rotate.

[0055] In the substrate processing apparatus 1 of the present invention, as an example, a reflow process may be performed. In addition, in the substrate processing apparatus 1 of the present invention, a process using heat may be performed without performing a reflow process.

[0056] The plurality of chambers 100, 200, 300, 400, 500 may include: a first chamber 100 for loading and unloading the substrate; a second chamber 200, a third chamber 300, and a fourth chamber 400 , us...

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Abstract

The purpose of the present invention is to provide a substrate processing device capable of preventing process defects caused by warping of a substrate on a stage on which substrate processing is performed. A substrate processing apparatus of the present invention for achieving this purpose comprises: a plurality of chambers arranged at predetermined intervals in a circumferential direction for processing a substrate; a turntable (600), which is provided so as to be rotatable for transferring a substrate between a plurality of chambers, at least one of the plurality of chambers being providedwith: a stage (110) on which the substrate is placed; a clamping ring (120) which is positioned above the substrate so as to overlap the edge position of the substrate by a predetermined width, and isprovided so as to be capable of moving up and down so as to prevent deformation of the substrate mounted on the stage (110); an elastic member (150) provided so as to exert an elastic force on the clamping ring (120) in the direction of the platform (110); and a clamping pin (160) configured to apply a force to the clamping ring (120) so as to face the elastic force acting on the clamping ring (120).

Description

technical field [0001] The present invention relates to a substrate processing device, in particular to a substrate processing device capable of preventing warpage of the substrate caused by heat during the substrate processing process. Background technique [0002] Recently, in order to overcome the limitations of increased two-dimensional integration and increase the functional density of components, silicon-based semiconductor integration technology has developed into a three-dimensional stacked integrated circuit (3D-stacked IC) in which more than two wafers are stacked. )technology. Silicon has the advantages of excellent mechanical properties and high thermal conductivity and most importantly, the accumulation of highly developed processing technology, but has the disadvantage of being unable to realize optical elements such as lasers and LEDs, ultra-high-speed elements such as HEMTs, and piezoelectric components, etc. Therefore, the realization of photoelectric comp...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/687
CPCH01L21/67011H01L21/68721H01L21/68742H01L21/67098H01L21/68764H01L21/67248H01L21/67288H01L21/67126H01L21/67736H01L21/6776
Inventor 孙侐主朴永秀柳守烈崔宇镇金学杜许东根吴俊昊
Owner SUBARU TECNICA INTERNATIONAL