Manufacturing process of LED chip array film

A LED chip and manufacturing process technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as high mold cost, chip breakage, and large loss, so as to improve the process yield and simplify the manufacturing process , to avoid the effect of crushing

Inactive Publication Date: 2021-03-26
YANGZHOU ZHONGKE SEMICON LIGHTING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The conventional chip array film production process mainly relies on the glue injection and film pressing process. This process requires the production of high-precision molds to ensure uniform film thickness. The problem with this method is that the cost of the mold is high, and once it is damaged, the loss will be huge; in addition , this production method will put a lot of pressure on the chip that has been solidified, which will easily lead to chip failure and other failures, and it will be difficult to repair later; Bubbles are difficult to eliminate and affect the uniformity and efficiency of the display module

Method used

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Embodiment Construction

[0022] In order to further understand the content of the present invention, the present invention will be further described below in conjunction with the examples.

[0023] A manufacturing process of an LED chip array film is characterized in that it comprises the following specific steps:

[0024] Step 1. First, press the flexible film made of PET or PI film on the operating platform through a hard frame to keep the flexible film stable during subsequent operations;

[0025] Then, on the top surface of the horizontally placed flexible film for temporary transition, a number of LED chips are arranged in an array according to the pre-designed arrangement rules, wherein the top surface of the flexible film in contact with the LED chips has a certain viscosity, so that the LED chips The chip is attached to the surface of the flexible film to form a complete chip array;

[0026] Step 2. Make a colloidal frame surrounding the chip array around the chip array. The thickness of the ...

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Abstract

The invention discloses a manufacturing process of an LED chip array film, and relates to the technical field of LEDs; and the manufacturing process comprises the following specific steps: arranging aplurality of LED chips into an array form on the top surface of a horizontally arranged flexible film for temporary transition according to a pre-designed arrangement rule; manufacturing a colloid frame surrounding the chip array at the periphery of the chip array; injecting a liquid jelly into the colloid frame, standing for a period of time until the liquid jelly is naturally leveled, and thencuring the liquid jelly to form a flat jelly film; and separating the colloidal film with the chip array from the flexible film and taking away the colloidal film and the flexible film to obtain the required chip array film. The technology is simple, the cost is greatly reduced, meanwhile, compared with a traditional film pressing technology, the bubble phenomenon is avoided, and the yield is effectively increased.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to a manufacturing process of an LED chip array film. Background technique [0002] The current Mini LED technology is progressing rapidly, and various companies are developing Mini LED die-bonding technology. At present, the widely used technology is mainly to use chip die-bonding to form an array, and then perform molding to make a protective film to form the required chip array film. . [0003] The conventional chip array film production process mainly relies on the glue injection and film pressing process. This process requires the production of high-precision molds to ensure uniform thickness of the film. The problem with this method is that the cost of the mold is high, and once it is damaged, the loss will be huge; in addition , this manufacturing method will put a lot of pressure on the chip that has been solidified, which will easily lead to chip failure and other failures, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/52H01L21/683H01L25/075
CPCH01L21/6835H01L25/0753H01L33/483H01L33/52H01L2221/68304H01L2933/0033H01L2933/005
Inventor 李志聪王国宏戴俊王恩平
Owner YANGZHOU ZHONGKE SEMICON LIGHTING
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