Manufacturing process of LED chip array film

A LED chip and manufacturing process technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as high mold cost, chip breakage, and large loss, so as to improve the process yield and simplify the manufacturing process , to avoid the effect of crushing
CN112563386AInactive Publication Date: 2021-03-26YANGZHOU ZHONGKE SEMICON LIGHTING
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
YANGZHOU ZHONGKE SEMICON LIGHTING
Publication Date
2021-03-26
Estimated Expiration
Not applicable ยท inactive patent
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Abstract

The invention discloses a manufacturing process of an LED chip array film, and relates to the technical field of LEDs; and the manufacturing process comprises the following specific steps: arranging aplurality of LED chips into an array form on the top surface of a horizontally arranged flexible film for temporary transition according to a pre-designed arrangement rule; manufacturing a colloid frame surrounding the chip array at the periphery of the chip array; injecting a liquid jelly into the colloid frame, standing for a period of time until the liquid jelly is naturally leveled, and thencuring the liquid jelly to form a flat jelly film; and separating the colloidal film with the chip array from the flexible film and taking away the colloidal film and the flexible film to obtain the required chip array film. The technology is simple, the cost is greatly reduced, meanwhile, compared with a traditional film pressing technology, the bubble phenomenon is avoided, and the yield is effectively increased.
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Description

technical field

[0001] The invention relates to the technical field of LEDs, in particular to a manufacturing process of an LED chip array film. Background technique

[0002] The current Mini LED technology is progressing rapidly, and various companies are developing Mini LED die-bonding technology. At present, the widely used technology is mainly to use chip die-bonding to form an array, and then perform molding to make a protective film to form the required chip array film. .

[0003] The conventional chip array film production process mainly relies on the glue injection and film pressing process. This process requires the production of high-precision molds to ensure uniform thickness of the film. The problem with this method is that the cost of the mold is high, and once it is damaged, the loss will be huge; in addition , this manufacturing method will put a lot of pressure on the chip that has been solidified, which will easily lead to chip failure and other failures, a...

Claims

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