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Notebook computer

A notebook computer and air inlet technology, which is applied in the computer field, can solve the problems of large cloth space, insufficient heat dissipation performance, and occupation of heat dissipation modules, and achieve the effects of reducing cloth space, improving layout flexibility, and improving heat dissipation performance

Pending Publication Date: 2021-03-30
合肥市卓怡恒通信息安全有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The heat dissipation module transfers the heat generated by the heating electronic components to the cooling fin group through the heat pipe, and uses the airflow generated by the fan to dissipate the heat at the cooling fin group to the surrounding air, which satisfies the requirements of the notebook computer to a certain extent. However, for notebook computers with large heat generation, the heat around the heat-generating components makes the air temperature inside the casing very high, and the heat cannot be taken away through the heat pipe alone, resulting in a slight lack of heat dissipation performance, which makes the notebook computer The heat dissipation effect needs to be improved
[0006] At the same time, in order to ensure the heat dissipation effect in the above-mentioned heat dissipation module, the air outlet of the fan must be arranged as close as possible to the heat dissipation fin set, that is, the fan and the heat dissipation fin set are inseparable and must be used as A whole is placed in the same area, and it cannot be divided into two parts for scattered arrangement, which will cause the heat dissipation module to occupy a large whole cloth space when it is arranged
At present, the layout space of notebook computers is becoming more and more tight, and the size of notebook computers is getting thinner and thinner. The layout of heat dissipation modules with this structure is becoming more and more difficult, and the utilization rate of the layout space inside notebook computers is also decreasing. unable to improve

Method used

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Embodiment Construction

[0034] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.

[0035] see Figure 1 to Figure 4 , the present invention provides a notebook computer, comprising: a casing 1, a heating element 2 and a heat dissipation assembly 3;

[0036] The heating element 2 and the heat dissipation assembly 3 are both arranged in the housing 1, and the outer surface of the housing 1 is provided with a first air inlet 11 and a first air outlet 12 spaced apart from each other;

[0037] The heat dissipation assembly 3 includes: an air source 31 , a first air guide pipe 32 , an air guide head 33 and a second air guide pipe 34 ;

[0038] The air source 31 is located at the first air inlet 11;

[0039] One end of the first air guide pipe 32 communicates with the air source 31, and the other end communicates with the air gui...

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Abstract

The invention provides a notebook computer. The notebook computer comprises a shell, a heating element and a heat dissipation assembly, wherein the heating element and the heat dissipation assembly are both arranged in the shell, and a first air inlet and a first air outlet which are spaced from each other are formed in the outer surface of the shell; the heat dissipation assembly comprises an airsource, a first air guide pipe, an air guide head and a second air guide pipe. The air source is arranged at the first air inlet; one end of the first air guide pipe is communicated with the air source, and the other end of the first air guide pipe is communicated with the air guide head; the air guide head is arranged at the first air outlet; one end of the second air guide pipe communicates with the air guide head, and the other end of the second air guide pipe extends to the peripheral area of the heating element. By improving the structure of the heat dissipation module, the heat dissipation performance of the notebook computer can be improved, meanwhile, the arrangement space occupied by the heat dissipation module is reduced, and the layout flexibility of the heat dissipation moduleis improved; and the notebook computer is lighter, thinner and more portable.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a notebook computer. Background technique [0002] Along with the continuous development of electronic technology, notebook computer (Notebook Computer) is liked by people because of its small and exquisite portable feature, has been used in a large number among people's daily life. [0003] A notebook computer is composed of hardware such as a monitor, keyboard / mouse, CPU, memory, and hard disk like a traditional desktop computer, but under the same composition, the notebook computer has the characteristics of small size, light weight, and easy portability. Generally speaking, portability is the biggest advantage of notebooks over desktop computers. The weight of a general notebook computer is only about 2 kilograms. Whether it is going out for work or traveling, it can be carried with you, which is very convenient. [0004] With the development of technology, the working spe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F1/16
CPCG06F1/1616G06F1/203
Inventor 白煜
Owner 合肥市卓怡恒通信息安全有限公司