A kind of dispensing equipment for semiconductor processing and its working method

Abstract

The invention discloses a glue dispensing device for semiconductor processing and a working method thereof, comprising a mounting base, a support column is symmetrically and fixedly installed on the top of the mounting base, a mounting top plate is arranged directly above the mounting base, and one end of the top of the support column is It is fixedly connected with the installation top plate. By setting the second motor and the third motor, it drives the dispensing tube to adjust the angle, so that the needle can dispens the side or corner of the processing component, which increases the diversity and flexibility of the dispensing angle. It enriches the application scenarios of the device and indirectly reduces the production cost. By setting the first anti-leakage strip and the second anti-leakage strip, and installing the adhesive strip on one side of the first anti-leakage strip, the roller connected by rotating the bottom of the guide column Control the gap between the first leak-proof strip and the second leak-proof strip, and fix the needle head together to reduce the occurrence of glue hanging, and at the same time avoid the pollution of the equipment caused by glue dripping, and reduce the cleaning work of the staff. Increased production efficiency.

Description

technical field [0001] The invention relates to a glue dispensing device, in particular to a glue dispensing device for semiconductor processing and a working method thereof. Background technique [0002] Glue dispensing is a process, also known as sizing, gluing, glue pouring, glue dropping, etc. It is to smear, fill, and drop electronic glue, oil or other liquids on the product, so that the product can stick and fill. Sealing, insulation, fixing, smooth surface and so on. [0003] The existing dispensing methods include manual dispensing, manual glue gun dispensing, semi-automatic dispensing machine dispensing and automatic dispensing machine, but the existing dispensing equipment is generally in the vertical direction during the dispensing process. Carrying out dispensing operations, and lack of a glue-splicing leak-proof device during the dispensing pause process will cause pollution to the conveying device. For this reason, we provide a dispensing equipment for semicon...

AI Technical Summary

Problems solved by technology

[0006] (1) How to drive the dispensing tube to adjust the angle by setting the second motor and the third motor, so that the needle can perform dispensing operations on the side or corner positions of the processing components, and solve the single dispensing angle of the dispensing head in the prior art , the problem of inflexibility in use occasions;

[0007] (2) How to arrange the first anti-leakage strip and the second anti-leakage strip, and install the adhesive strip on one side of the first anti-leakage strip, and use the roller connected at the bottom of the guide post to adjust the first anti-leakage strip and the second anti-leakage strip The gap between leaking strips is controlled to solve the problem of equipment pollution and difficulty in cleaning due to the lack of leak-proof glue bonding mechanism in the prior art

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